Novel package electrical characterization process - application on plastic BGA packages

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 304-309

  Chung, Chee Yee ^a  

^a Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

CIRCUIT THEORY; COMPUTER SIMULATION; MATHEMATICAL MODELS; PLASTICS APPLICATIONS;

PLASTIC BALL GRID ARRAY PACKAGES;

ELECTRONICS PACKAGING;

EID: 0031329484     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (22)