Self-heating and reliability issues in FinFET and 3D ICs

Proceedings - 2014 IEEE 12th International Conference on Solid-State and Integrated Circuit Technology, ICSICT 2014

Volumn , Issue , 2014, Pages

  Khan, Muhammad Imran ^a   Buzdar, Abdul Rehman ^a   Lin, Fujiang ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

3D ICs; FinFET; Modeling; Reliability; Self heating; Transistor

Indexed keywords

HEATING; INTEGRATED CIRCUITS; MODELS; RELIABILITY; TRANSISTORS;

3-D ICS; COMPLEX GEOMETRIES; DESIGN CONSIDERATIONS; FINFET; METAL WIRES; PLANAR TRANSISTORS; SELF-HEATING;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84946692642     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSICT.2014.7021443     Document Type: Conference Paper

References (6)

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