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Volumn 2, Issue , 2003, Pages 703-708
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A high sensitivity force sensor for microassembly: Design and experiments
a a b c |
Author keywords
Adhesives; Assembly; Calibration; Electronics packaging; Force sensors; Microassembly; Monitoring; Optical microscopy; Optical sensors; Surface tension
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Indexed keywords
ADHESIVES;
ASSEMBLY;
CALIBRATION;
DATA HANDLING;
ELECTRONICS PACKAGING;
IMAGE PROCESSING;
MONITORING;
OPTICAL DATA PROCESSING;
OPTICAL MICROSCOPY;
OPTICAL SENSORS;
SURFACE TENSION;
AUTOMATED MANUFACTURING PROCESS;
DATA PROCESSING TECHNIQUES;
FORCE SENSOR;
MICRO ASSEMBLY;
MICRO MANIPULATION;
PACKAGING PROCESS;
PIEZOELECTRIC FORCE;
POLYVINYLIDENE FLUORIDES;
INTELLIGENT MECHATRONICS;
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EID: 84943428091
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/AIM.2003.1225429 Document Type: Conference Paper |
Times cited : (29)
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References (10)
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