Cuprous oxide nanoparticles in epoxy network: Cure reaction, morphology, and thermal stability

Polymer Engineering and Science

Volumn 55, Issue 10, 2015, Pages 2293-2306

  Tresa Sunny, Anu ^a   Vijayan P , Poornima ^a,b   George, Thresiamma ^a,c   Pickering, Kim ^d   Mathew, Suresh ^a   Thomas, Sabu ^a,e  

^a MAHATMA GANDHI UNIVERSITY   (India)

^b Qatar University   (Qatar)

^c KINGS COLLEGE OF ENGINEERING   (India)

^d UNIVERSITY OF WAIKATO   (New Zealand)

^e UNIVERSITI TEKNOLOGI MARA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER OXIDES; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; GLASS TRANSITION; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; MORPHOLOGY; NANOCOMPOSITES; NITROGEN COMPOUNDS; SCANNING ELECTRON MICROSCOPY;

CUPROUS OXIDE; CURE REACTIONS; EPOXY; EPOXY NETWORK; FILLER PARTICLES; HYDRAZINE-REDUCTION; OCTAHEDRAL MORPHOLOGY; OXIDE FILLERS; REDUCTION METHOD; SYNTHESISED;

THERMODYNAMIC STABILITY;

EID: 84941876871     PISSN: 00323888     EISSN: 15482634     Source Type: Journal    
DOI: 10.1002/pen.24116     Document Type: Article

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