Cure monitoring and residual stress sensing of single-carbon fiber reinforced epoxy composites using electrical resistivity measurement

Composites Science and Technology

Volumn 65, Issue 3-4, 2005, Pages 571-580

  Park, Joung Man ^a   Lee, Sang Il ^a   Choi, Jin Ho ^a  

^a Gyeongsang National University   (South Korea)

Author keywords

B. Interfacial strength; C. Residual stress; Cure monitoring; D. Acoustic emission; Electrical resistivity

Indexed keywords

CURING; ELASTIC MODULI; ELECTRIC CONDUCTIVITY; EPOXY RESINS; FIBER REINFORCED MATERIALS; FINITE ELEMENT METHOD; MATRIX ALGEBRA; RESIDUAL STRESSES; THERMAL EFFECTS;

CURING MONITORING; EPOXY MATRIX MODULUS; FIBER CIRCUMFERENCE; TEMPERATURE SENSING;

COMPOSITE MATERIALS;

CARBON FIBER; FIBER REINFORCED COMPOSITE; MEASURING; MONITORING; STRESS;

EID: 11344262641     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2004.09.019     Document Type: Article

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