-
1
-
-
84938580104
-
-
International Technology Roadmap for Semiconductors (ITRS)
-
Various microprocessor datasheets; vvww. intel. com. International Technology Roadmap for Semiconductors (ITRS), 2006 update.
-
(2006)
Various Microprocessor Datasheets
-
-
-
2
-
-
33947286619
-
Thermal interface materials: Historical perspective, status, and future directions
-
R. Prasher, "Thermal interface materials: historical perspective, status, and future directions, " Proceedings of the IEEE, vol. 94, pp. 1571-1586, 2006.
-
(2006)
Proceedings of the IEEE
, vol.94
, pp. 1571-1586
-
-
Prasher, R.1
-
3
-
-
21044457255
-
Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI)
-
K. Shakeri and J. D. Meindl, "Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI), " IEEE Trans. Electron Devices, vol. 52, pp. 1087-1096, 2005.
-
(2005)
IEEE Trans. Electron Devices
, vol.52
, pp. 1087-1096
-
-
Shakeri, K.1
Meindl, J.D.2
-
4
-
-
16244362042
-
Feasibility of Monolithic and 3D-Stacked DC-DC Converters for Microprocessors in 90nm Technology Generation
-
G. Schrom, P. Hazucha, H. Jae-Hong, V. Kursun, D. Gardner, S. Narendra, T. Karnik, and D. Vivek, "Feasibility of Monolithic and 3D-Stacked DC-DC Converters for Microprocessors in 90nm Technology Generation, " in Proc. IEEE Int. Symp. Low Power Electronics and Design (ISLPED), 2004, pp. 263-268.
-
(2004)
Proc. IEEE Int. Symp. Low Power Electronics and Design (ISLPED)
, pp. 263-268
-
-
Schrom, G.1
Hazucha, P.2
Jae-Hong, H.3
Kursun, V.4
Gardner, D.5
Narendra, S.6
Karnik, T.7
Vivek, D.8
-
5
-
-
33947286156
-
Advanced package technologies for high performance systems
-
D. Mallik, K. Radhakrishnan, J. He, C.-P. Chiu, T. Kamgaing, D. Searls, and J. D. Jackson, "Advanced package technologies for high performance systems, " Intel Technol. J., vol. 9, pp. 259-271, 2005.
-
(2005)
Inter Technol. J.
, vol.9
, pp. 259-271
-
-
Mallik, D.1
Radhakrishnan, K.2
He, J.3
Chiu, C.-P.4
Kamgaing, T.5
Searls, D.6
Jackson, J.D.7
-
6
-
-
20844454351
-
A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package
-
P. Hazucha, G. Schrom, H. Jaehong, B. A. Bloechel, P. Hack, G. E. Dermer, S. Narendra, D. Gardner, T. Karnik, V. De, and S. Borkar, "A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package, " IEEE J. Solid-State Circuits, vol. 40, pp. 838-845, 2005.
-
(2005)
IEEE J. Solid-State Circuits
, vol.40
, pp. 838-845
-
-
Hazucha, P.1
Schrom, G.2
Jaehong, H.3
Bloechel, B.A.4
Hack, P.5
Dermer, G.E.6
Narendra, S.7
Gardner, D.8
Karnik, T.9
De, V.10
Borkar, S.11
-
7
-
-
0242409707
-
Optical interconnects: Out of the box forever
-
H. Dawei, T. Sze, A. Landin, R. Lytel, and H. L. Davidson, "Optical interconnects: out of the box forever, " IEEE J. Selected Topics in Quantum Electronics, vol. 9, pp. 614-623, 2003.
-
(2003)
IEEE J. Selected Topics in Quantum Electronics
, vol.9
, pp. 614-623
-
-
Dawei, H.1
Sze, T.2
Landin, A.3
Lytel, R.4
Davidson, H.L.5
-
8
-
-
0000894702
-
Rationale and challenges for optical interconnects to electronic chips
-
D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips, " Proceedings of the IEEE, vol. 88, pp. 728-749, 2000.
-
(2000)
Proceedings of the IEEE
, vol.88
, pp. 728-749
-
-
Miller, D.A.B.1
-
9
-
-
0141940290
-
Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)
-
M. S. Bakir, H. A. Reed, H. D. Thacker, C. S. Patel, P. A. Kohl, K. P. Martin, and J. D. Meindl, "Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI), " IEEE Trans. Electron Devices, vol. 50, pp. 2039-2048, 2003.
-
(2003)
IEEE Trans. Electron Devices
, vol.50
, pp. 2039-2048
-
-
Bakir, M.S.1
Reed, H.A.2
Thacker, H.D.3
Patel, C.S.4
Kohl, P.A.5
Martin, K.P.6
Meindl, J.D.7
-
10
-
-
0242365655
-
Sea of polymer pillars: Compliant wafer-level electrical-optical chip I/O interconnections
-
M. S. Bakir, T. K. Gaylord, K. P. Martin, and J. D. Meindl, "Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections, " IEEE Photonics Technol. Lett., vol. 15, pp. 1567-1569, 2003.
-
(2003)
IEEE Photonics Technol. Lett.
, vol.15
, pp. 1567-1569
-
-
Bakir, M.S.1
Gaylord, T.K.2
Martin, K.P.3
Meindl, J.D.4
-
11
-
-
34248634019
-
Flexible polymer pillars for optical chip assembly: Materials, structures, and characterization
-
M. S. Bakir, P. A. Kohl, A. L. Glebov, E. Elce, D. Bhusari, M. G. Lee, and J. D. Meindl, "Flexible polymer pillars for optical chip assembly: materials, structures, and characterization, " in Proc. SPIE Photonics West, 2007.
-
(2007)
Proc. SPIE Photonics West
-
-
Bakir, M.S.1
Kohl, P.A.2
Glebov, A.L.3
Elce, E.4
Bhusari, D.5
Lee, M.G.6
Meindl, J.D.7
-
12
-
-
4344582225
-
Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration
-
M. S. Bakir and J. D. Meindl, "Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration, " IEEE Trans. Electron Devices, vol. 51, pp. 1069-1077, 2004.
-
(2004)
IEEE Trans. Electron Devices
, vol.51
, pp. 1069-1077
-
-
Bakir, M.S.1
Meindl, J.D.2
-
13
-
-
31644448596
-
Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink
-
B. Dang, M. S. Bakir, and J. D. Meindl, "Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink, " IEEE Electron DeviceLett, vol. 27, pp. 117-119, 2006.
-
(2006)
IEEE Electron DeviceLett
, vol.27
, pp. 117-119
-
-
Dang, B.1
Bakir, M.S.2
Meindl, J.D.3
-
14
-
-
28244477379
-
Wafer-level microfluidic cooling interconnects for GSI
-
B. Dang, P. Joseph, M. Bakir, T. Spencer, P. Kohl, and J. Meindl, "Wafer-level microfluidic cooling interconnects for GSI, " in IEEE Int. Interconnect Technol. Conf., 2005, pp. 180-182.
-
(2005)
IEEE Int. Interconnect Technol. Conf.
, pp. 180-182
-
-
Dang, B.1
Joseph, P.2
Bakir, M.3
Spencer, T.4
Kohl, P.5
Meindl, J.6
-
15
-
-
33645817533
-
Flexible pillars for displacement compensation in optical chip assembly
-
A. L. Glebov, D. Bhusari, P. Kohl, M. S. Bakir, J. D. Meindl, and M. G. Lee, "Flexible pillars for displacement compensation in optical chip assembly, " IEEE Photonics Technol. Lett, vol. 18, pp. 974-976, 2006.
-
(2006)
IEEE Photonics Technol. Lett
, vol.18
, pp. 974-976
-
-
Glebov, A.L.1
Bhusari, D.2
Kohl, P.3
Bakir, M.S.4
Meindl, J.D.5
Lee, M.G.6
-
16
-
-
15744394622
-
Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations
-
H. Y. Zhang, D. Pinjala, T. N. Wong, and Y. K. Joshi, "Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations, " IEEE Trans. Components and Packaging Technol, vol. 28, pp. 127-135, 2005.
-
(2005)
IEEE Trans. Components and Packaging Technol
, vol.28
, pp. 127-135
-
-
Zhang, H.Y.1
Pinjala, D.2
Wong, T.N.3
Joshi, Y.K.4
-
18
-
-
0019563707
-
High-performance heat sinking for VLSI
-
D. B. Tuckerman and R. F. W. Pease, "High-performance heat sinking for VLSI, " IEEE Electron Dev. Lett, vol. 2, pp. 126-129, 1981.
-
(1981)
IEEE Electron Dev. Lett
, vol.2
, pp. 126-129
-
-
Tuckerman, D.B.1
Pease, R.F.W.2
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