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Volumn , Issue , 2007, Pages 421-428

Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER TRANSMISSION; INTEGRATED CIRCUITS;

EID: 84938569712     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/CICC.2007.4405766     Document Type: Conference Paper
Times cited : (15)

References (18)
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    • (2006) Various Microprocessor Datasheets
  • 2
    • 33947286619 scopus 로고    scopus 로고
    • Thermal interface materials: Historical perspective, status, and future directions
    • R. Prasher, "Thermal interface materials: historical perspective, status, and future directions, " Proceedings of the IEEE, vol. 94, pp. 1571-1586, 2006.
    • (2006) Proceedings of the IEEE , vol.94 , pp. 1571-1586
    • Prasher, R.1
  • 3
    • 21044457255 scopus 로고    scopus 로고
    • Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI)
    • K. Shakeri and J. D. Meindl, "Compact physical IR-drop models for chip/package co-design of gigascale integration (GSI), " IEEE Trans. Electron Devices, vol. 52, pp. 1087-1096, 2005.
    • (2005) IEEE Trans. Electron Devices , vol.52 , pp. 1087-1096
    • Shakeri, K.1    Meindl, J.D.2
  • 8
    • 0000894702 scopus 로고    scopus 로고
    • Rationale and challenges for optical interconnects to electronic chips
    • D. A. B. Miller, "Rationale and challenges for optical interconnects to electronic chips, " Proceedings of the IEEE, vol. 88, pp. 728-749, 2000.
    • (2000) Proceedings of the IEEE , vol.88 , pp. 728-749
    • Miller, D.A.B.1
  • 9
    • 0141940290 scopus 로고    scopus 로고
    • Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI)
    • M. S. Bakir, H. A. Reed, H. D. Thacker, C. S. Patel, P. A. Kohl, K. P. Martin, and J. D. Meindl, "Sea of Leads (SoL) ultrahigh density wafer-level chip input/output interconnections for gigascale integration (GSI), " IEEE Trans. Electron Devices, vol. 50, pp. 2039-2048, 2003.
    • (2003) IEEE Trans. Electron Devices , vol.50 , pp. 2039-2048
    • Bakir, M.S.1    Reed, H.A.2    Thacker, H.D.3    Patel, C.S.4    Kohl, P.A.5    Martin, K.P.6    Meindl, J.D.7
  • 10
    • 0242365655 scopus 로고    scopus 로고
    • Sea of polymer pillars: Compliant wafer-level electrical-optical chip I/O interconnections
    • M. S. Bakir, T. K. Gaylord, K. P. Martin, and J. D. Meindl, "Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections, " IEEE Photonics Technol. Lett., vol. 15, pp. 1567-1569, 2003.
    • (2003) IEEE Photonics Technol. Lett. , vol.15 , pp. 1567-1569
    • Bakir, M.S.1    Gaylord, T.K.2    Martin, K.P.3    Meindl, J.D.4
  • 12
    • 4344582225 scopus 로고    scopus 로고
    • Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration
    • M. S. Bakir and J. D. Meindl, "Sea of polymer pillars electrical and optical chip I/O interconnections for gigascale integration, " IEEE Trans. Electron Devices, vol. 51, pp. 1069-1077, 2004.
    • (2004) IEEE Trans. Electron Devices , vol.51 , pp. 1069-1077
    • Bakir, M.S.1    Meindl, J.D.2
  • 13
    • 31644448596 scopus 로고    scopus 로고
    • Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink
    • B. Dang, M. S. Bakir, and J. D. Meindl, "Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink, " IEEE Electron DeviceLett, vol. 27, pp. 117-119, 2006.
    • (2006) IEEE Electron DeviceLett , vol.27 , pp. 117-119
    • Dang, B.1    Bakir, M.S.2    Meindl, J.D.3
  • 16
    • 15744394622 scopus 로고    scopus 로고
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    • H. Y. Zhang, D. Pinjala, T. N. Wong, and Y. K. Joshi, "Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations, " IEEE Trans. Components and Packaging Technol, vol. 28, pp. 127-135, 2005.
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  • 18
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    • High-performance heat sinking for VLSI
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    • Tuckerman, D.B.1    Pease, R.F.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.