Preparation and characterization of copper/silver bimetallic nanowires with core-shell structure

Surface and Interface Analysis

Volumn 47, Issue 4, 2015, Pages 529-534

  Zhao, Jun ^a   Zhang, Dongming ^b   Zhang, Xiuli ^a  

^a QINGDAO UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b WUHAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Ag Cu bimetallic nanowires; anti oxidation; chemical replacement; copper nanowires; silver coating

Indexed keywords

COATINGS; COMPOSITE COATINGS; DIFFERENTIAL THERMAL ANALYSIS; ELECTRON PROBE MICROANALYSIS; MOLAR RATIO; NANOWIRES; SCANNING ELECTRON MICROSCOPY; SHELLS (STRUCTURES); SILVER; SUBSTITUTION REACTIONS; X RAY PHOTOELECTRON SPECTROSCOPY;

ANTI-OXIDATION; COMPOSITE NANOWIRES; COPPER NANOWIRES; CORE SHELL STRUCTURE; MICROSCOPIC ANALYSIS; POLYVINYL PYROLLIDONE; REPLACEMENT REACTIONS; SILVER COATINGS;

COPPER METALLOGRAPHY;

EID: 84924729715     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.5743     Document Type: Article

References (23)

1. J. I. Pascual, J. Mendez, J. GomezHerrero, A. M. Baro, N. Garcia, U. Landman, W. D. Luedtke, E. N. Bogachek, H. P. Cheng, Science 1995, 267, 1793.
2. Y. Cui, Q. Wei, H. Park, C. M. Lieber, Science 2001, 293,1289.
3. L. T. Cai, H. Skulason, J. G. Kushmerick, S. K. Pollack, J. Naciri, R. Shashidhar, J. Phys. Chem. B 2004, 108, 2827.
4. M. Yun, N. V. Myung, R. P. Vasquez, C. Lee, E. Menke, R. M. Penner, Nano Lett. 2004, 4, 419.
5. C. J. Murphy, A. M. Gole, S. E. Hunyadi, C. J. Orendorff, Inorg. Chem. 2006, 45, 7544.
6. J. Weeber, A. Dereux, C. Girarad, J. R. Krenn, J. P. Goudonnet, J. Phys. Rev. B 1999, 60, 9061.
7. W. L. Barnes, A. Dereux, T. W. Ebbesed, Nature 2003, 424, 824.
8. F. Liu, J. Y. Lee, W. J. Zhou, Small 2006, 2, 121.
9. R. M. Dickson, L. A. Lyon, J. Phys. Chem. B 2000, 104, 6095.
10. D. H. Reich, M. Tanase, A. Hultgren, L. A. Bauer, C. S. Chen, G. J. Meyer, J. Appl. Phys. 2003, 93, 7275.
11. L. Bin, A. G. Genaro, A. H. Joel, S. Uttandaraman, Ind. Eng. Chem. Res. 2007, 46, 2481.
12. M. E. Molares, E. M. Höhberger, C. Schaeflein, R. H. Blick, R. Neumann, C. Trautmann, Appl. Phys. Lett. 2003, 82, 2139.
13. X. M. Liu, Y. C. Zhou, J. Mater. Res. 2005, 20,2371.
14. Z. W. Liu, Y. Bando, Chem. Phys. Lett. 2003, 378, 85.
15. E. Takeshima, K. Takatsu, Y. Kojima, T. Fujji, US Patent 1990, 235, 954.
16. X. Xu, X. Luo, H. Zhuang, W. Li, B. Zhang. Mater. Lett. 2003, 57, 3987.
17. D. M. Makowiecki, J. A. Kerns, C. S. Alford, M. A. Mckernan, US Patent B1 2002, 355, 146.
18. T. Hayashi, US Patent 1993, 178, 909.
19. J. Yang, L. J. Yang, H. P. Too, J. Phys. Chem. B 2005, 109, 19208.
20. H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung, C. O. Kim, Surface Coatings Technol. 2006, 201, 3788.
21. Y. Chang, M. L. Lye, H. C. Zeng, Langmuir 2005, 21, 3746.
22. S. P. Wu, R. Y. Gao, L. H. Xu, J. Mater. Process. Technol. 2009, 209,1129.
23. A. Muzikansky, P. Nanikashvili, J. Grinblat, D. Zitoun, J. Phys. Chem. C 2013, 117, 3093.