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Volumn 209, Issue 3, 2009, Pages 1129-1133
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Preparation of micron-sized flake copper powder for base-metal-electrode multi-layer ceramic capacitor
a
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Author keywords
Ball milling; BME MLCCs; Chemical reduction; Flake powders; Micron sized copper powders; Thick films
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Indexed keywords
BALL MILLING;
CAPACITANCE;
CAPACITORS;
CERAMIC CAPACITORS;
CERAMIC MATERIALS;
CONDUCTIVE MATERIALS;
COPPER;
COPPER COMPOUNDS;
COPPER POWDER;
COPPER POWDER METALLURGY;
DIELECTRIC DEVICES;
ELECTRIC EQUIPMENT;
ELECTROLYSIS;
ELECTROLYTIC CAPACITORS;
FILM PREPARATION;
GRAVIMETRIC ANALYSIS;
GRINDING (MACHINING);
HYDRATES;
MILLING (MACHINING);
MILLING MACHINES;
PHOTOGRAPHY;
POWDER METALS;
SCANNING ELECTRON MICROSCOPY;
THERMOANALYSIS;
THICK FILMS;
BME-MLCCS;
CHEMICAL REDUCTION;
DIFFERENTIAL THERMOGRAVIMETRY;
DISPERSIBILITY;
FLAKE POWDERS;
HYDRAZINE HYDRATES;
MECHANICAL METHODS;
MICRON-SIZED COPPER POWDERS;
MILLING PROCESSES;
MONODISPERSED;
POLARIZED LIGHTS;
POWDER PARTICLES;
SPECIFIC AREAS;
TERMINAL ELECTRODES;
THERMOGRAVIMETRY;
UNIFORM SIZES;
POWDERS;
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EID: 57949091884
PISSN: 09240136
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jmatprotec.2008.03.010 Document Type: Article |
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Times cited : (21)
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References (12)
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