Boron nitride filled epoxy with improved thermal conductivity and dielectric breakdown strength

Composites Science and Technology

Volumn 110, Issue , 2015, Pages 152-158

  Donnay, Martin ^a   Tzavalas, Spiros ^a   Logakis, Emmanuel ^a  

^a ABB CORPORATE RESEARCH   (Switzerland)

Author keywords

A. Nano particles; A. Polymer matrix composites (PMCs); B. Electrical properties; B. Thermal properties; E. Casting

Indexed keywords

BALL MILLING; BORON NITRIDE; COUPLING AGENTS; DISPERSIONS; ELECTRIC BREAKDOWN; FILLERS; MILLING (MACHINING); NANOPARTICLES; NITRIDES; PARTICLE SIZE; POLYMER MATRIX COMPOSITES; SILANES;

DIELECTRIC BREAKDOWN STRENGTH; E. CASTING; ELECTRICAL APPLICATIONS; EPOXY-MATRIX COMPOSITE; MORPHOLOGICAL ANALYSIS; POLYMER MATRIX COMPOSITES (PMCS); SILANE COUPLING AGENT; THERMAL CONDUCTIVITY MEASUREMENTS;

THERMAL CONDUCTIVITY;

EID: 84923091548     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2015.02.006     Document Type: Article

References (32)

1. Huang X., Jiang P., Tanaka T. A review of dielectric polymer composites with high thermal conductivity. IEEE Electr Insul Mag 2011, 272011:8-16.
2. Zhi C., Bando Y., Terao T., Tang C., Kuwahara H., Golberg D. Towards thermoconductive, electrically insulating polymeric composites with boron nitride nanotubes as fillers. Adv Funct Mater 2009, 19:1857-1862.
3. Wong C.P., Bollampally R.S. Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging. J Appl Polym Sci 1999, 74(14):3396-3403.
4. Procter P., Solc J. Improved thermal-conductivity in microelectronic encapsulants. IEEE Trans Compon Hybrids Manuf Technol 1991, 14:708-713.
5. Xu Y., Chung D.D.L., Mroz C. Thermally conducting aluminum nitride polymer-matrix composites. Composites Part A 2001, 32(12):1749-1757.
6. 4 particle filled epoxy composites with a novel structure. J Electron Packag 2007, 129:469-472.
7. Zhang Y., Hu X., Zhao J.H., Sheng K., Cannon W.R., Wang X., et al. Rheology and thermal conductivity of diamond powder-filled liquid epoxy encapsulants for electronic packaging. IEEE Trans Compon Packag Technol 2009, 32(4):716-723.
8. Tanaka T., Kozako M., Okamoto K. Toward high thermal conductivity nano micro epoxy composites with sufficient endurance voltage. J Int Counc Electr Eng 2012, 2(1):90-98.
9. Chiang T.H., Hsieh T.E. A study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filler. J Inorg Organomet Polym Mater 2006, 16(2):175-183.
10. Zhu B.L., Ma J., Wu J., Yung K.C., Xie C.S. Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles. J Appl Polym Sci 2010, 118(5):2754-2764.
11. Kochetov R., Andritsch T., Morshuis P.H.F., Smit J.J. Effect of filler size on complex permittivity and thermal conductivity of epoxy-based composites filled with BN particles. IEEE Conf Electr Insul Dielectr Phenom 2010, 534-537.
12. Wang Z., Iizuka T., Kozako M., Ohki Y., Tanaka T. Development of epoxy/BN composites with high thermal conductivity and sufficient dielectric breakdown strength. IEEE Trans Dielectr Electr Insul 2011, 18(6):1963-1972.
13. Bujard P. Thermal conductivity of boron nitride filled epoxy resins: temperature dependence and influence of sample preparation. IEEE Therm Phenom Fabr Oper Electron Compon 1988, 41-49.
14. Xu Y.S., Chung D.D.L. Increasing the thermal conductivity of boron nitride and aluminum nitride particle epoxy-matrix composites by particle surface treatments. Compos Interfaces 2000, 7(4):243-256.
15. Tanaka T., Wang Z., Iizuka T., Kozako M., Ohki Y. High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength. IEEE Power Energy Syst 2011, 1-4.
16. Wattanakul K., Manuspiya H., Yanumet N. Thermal conductivity and mechanical properties of BN-filled epoxy composite: effects of filler content, mixing conditions, and BN agglomerate size. J Compos Mater 2011, 45(19):1967-1980.
17. Reading M., Vaughan A.S., Lewin P.L. An investigation into improving the breakdown strength and thermal conduction of an epoxy system using boron nitride. IEEE Electr Insul Dielectr Phenom 2011, 636-639.
18. Lin Z., McNamara A., Liu Y., Moon K.S., Wong C.P. Exfoliated hexagonal boron nitride-based polymer nanocomposite with enhanced thermal conductivity for electronic encapsulation. Compos Sci Technol 2014, 90:123-128.
19. Cho H.B., Tu N.C., Fujihara T., Endo S., Suzuki T., Tanaka S., et al. Epoxy resin-based nanocomposite films with highly oriented BN nanosheets prepared using a nanosecond-pulse electric field. Mater Lett 2011, 65(15-16):2426-2428.
20. Kozako M., Valdez-Nava Z., Diaham S., Dinculescu S., Lebey T. Fundamental investigation of dielectric phenomena in epoxy composites during curing process under a uniform electric field. IEEE Electr Insul Dielectr Phenom 2012, 547-550.
21. Yung K.C., Liem H. Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing. J Appl Polym Sci 2007, 106(6):3587-3591.
22. Hong J.P., Yoon S.W., Hwang T., Oh J.S., Hong S.C., Lee Y., et al. High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers. Thermochim Acta 2012, 537:70-75.
23. Wattanakul K., Manuspiya H., Yanumet N. Effective surface treatments for enhancing the thermal conductivity of BN-filled epoxy composite. J Appl Polym Sci 2011, 119(6):3234-3243.
24. Kim K., Kim J. Fabrication of thermally conductive composite with surface modified boron nitride by epoxy wetting method. Ceram Int 2014, 40(4):5181-5189.
25. Hong J.P., Yoon S.W., Hwang T.S., Lee Y.K., Won S.H., Nam J.D. Interphase control of boron nitride/epoxy composites for high thermal conductivity. Korea-Australia Rheol J 2010, 22(4):259-264.
26. Peng W., Huang X., Yu J., Jiang P., Liu W. Electrical and thermophysical properties of epoxy/aluminum nitride nanocomposites: effects of nanoparticle surface modification. Composites Part A 2010, 41(9):1201-1209.
27. Kim K., Kim M., Hwang Y., Kim J. Chemically modified boron nitride-epoxy terminated dimethylsiloxane composite for improving the thermal conductivity. Ceram Int 2014, 40(1):2047-2056.
28. Joni I.M., Balgis R., Ogi T., Iwaki T., Okuvama K. Surface functionalization for dispersing and stabilizing hexagonal boron nitride nanoparticle by bead milling. Colloids Surf A Physicochem Eng Aspects 2011, 388(1-3):49-58.
29. Telford J.K. A Brief introduction to design of experiments. Johns Hopkins APL Tech Dig 2007, 27(3):224-232.
30. Huang M.T., Ishida H. Surface study of hexagonal boron nitride powder by diffuse reflectance Fourier transform infrared spectroscopy. Surf Interface Anal 2005, 37(7):621-627.
31. Dissado L.A., Fothergill J.C. Electrical degradation and breakdown in polymers 1992, Peter Peregrinus Ltd. G.C. Stevens (Ed.).
32. Tuncer E., James D.R., Sauers I., Ellis A.R., Pace M.O. On dielectric breakdown statistics. J Phys D Appl Phys 2006, 39:4257-4268.