High thermal conductive Si3N4 particle filled epoxy composites with a novel structure

Journal of Electronic Packaging

Volumn 129, Issue 4, 2007, Pages 469-472

  He, Hong ^a   Fu, Renli ^a   Han, Yanchun ^a   Shen, Yuan ^a   Wang, Deliu ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

Author keywords

Ceramic filler; Dielectric properties; Polymer composite; Thermal conductivity

Indexed keywords

CONDUCTIVE PLASTICS; DIELECTRIC PROPERTIES; EPOXY RESINS; MICROSTRUCTURE; SILICON COMPOUNDS; STRUCTURAL DESIGN; THERMAL CONDUCTIVITY; VOLUME FRACTION;

CERAMIC FILLERS; CONDUCTIVE POLYMERS; PARTICLE FILLED EPOXY COMPOSITES; PREMIXING;

POLYMER MATRIX COMPOSITES;

EID: 38749141755     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2804097     Document Type: Article

References (17)

1. Zweben, C., 2002, "Advances in Materials for Optoelectronic, Microelectronic and MOEMS/MEMS Packaging," Proceedings of 18th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, IEEE, Piscataway, NJ, pp. 30-34.
2. Ohashi, M., Kawakam, S., Yokogawa, Y., and Lai, G. C., 2005, "Spherical Aluminum Nitride Fillers for Heat-Conducting Plastic Packages," J. Am. Ceram. Soc., 88(9), pp. 2115-2118.
3. Nitesh, K., Markondeya, R. P., and Raghuram, V. P., 2005, "Recent Advance in Composite Substrate Material for High-Density and High Reliability Packaging Applications," Proceedings 55th Electronic Components and Technology Conference, IEEE, Piscataway, NJ, pp. 1363-1372.
4. Siu, B., 1995, "High-Performance Microprocessor Packaging in the Year 2000 Technical and Economic Barriers and Alternatives," Proceedings of IEEE Region Tenth International Conference on Microelectronics and VLSI. Asia-Pacific Microelectronics 2000' Proceedings, IEEE, New York, pp. 234-237.
5. Lee, W. S., Han, I. Y., Yu, J., Kim, S. J., and Lee, T. Y., 2004, "Thermal Characterization of Thermally Conductive Underfill for a Flip-chip Package Using Novel Temperature Sensing Technique," Proceedings of Sixth Electronics Packaging Technology Conference, IEEE, Piscataway, NJ, pp. 47-52.
6. Bujard, P., Kuhnlein, G., Ino, S., and Shiobara, T., 1994, "Thermal Conductivity of Molding Compounds for Plastic Packaging," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 17(4), pp. 527-532.
7. Lee, G. W., Park, M., Kim, J., Lee, J. I., and Yoon, H. G., 2006, "Enhanced Thermal Conductivity of Polymer Composites Filled With Hybrid Filler," Composites, Part A, 37(5), pp. 727-734.
8. Bae, J. W., Kim, W., and Cho, S. H., 2000, "The Properties of AlN-filled Epoxy Molding Compounds by the Effects of Filler Size Distribution," J. Mater. Sci., 35(23), pp. 5907-5913.
9. Lee, H., and Neville, K., 1982, Handbook of Epoxy Resins, McGraw-Hill, New York.
10. Hirao, K., Watari, K., Hayashi, H., and Kitayama, M., 2001, "High Thermal Conductivity Silicon Nitride Ceramic," MRS Bull., 26(6), pp. 451-455.
11. Wong, C. P., and Bollampally, R. S., 1999, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging," IEEE Trans. Adv, Packag., 22(1), pp. 54-59.
12. Xu, Y., Chung, D. D. L., and Mroz, C., 2001, "Thermally Conducting Aluminum Nitride Polymer-Matrix Composites," Composites, Part A, 32(12), pp. 1749-1757.
13. Procter, P., and Sole, J., 1991, "Improved Thermal Conductivity in Microelectronic Encapsulants," IEEE Trans. Compon., Hybrids, Manuf. Technol., 14(4), pp. 708-713.
14. Bolt, J. D., Button, D. P., and Yost, B. A., 1989, "Ceramic-Fiber- Polymer Composites for Electronic Substrates," Mater. Sci. Eng., A, 109(1), pp. 207-211.
15. Bolt, J. D., and French, R. H., 1988, "Polymer/Ceramic Composites. New Properties for Electronics," SAMPE J., 34(1), pp. 32-35.
16. 4/PS Composites Used for Electronic Packaging," Compos. Sci. Technol., 67, pp. 2493-2499.
17. Fan, L., Su, B., Qu, J., and Wong, C. P., 2004, "Electrical and Thermal Conductivities of Polymer Composites Containing Nano-Sized Particles," Proceedings of 54th Electronic Components and Technology Conference, IEEE, Piscaluway, NJ, pp. 148-154.