A review of dielectric polymer composites with high thermal conductivity

IEEE Electrical Insulation Magazine

Volumn 27, Issue 4, 2011, Pages 8-16

  Huang, Xingyi ^a   Jiang, Pingkai ^a   Tanaka, Toshikatsu ^b  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b WASEDA UNIVERSITY   (Japan)

Author keywords

Breakdown strength; Coefficient of thermal expansion; High thermal conductivity filler; Polymer dielectric composite; Thermal conductivity; Thermal interfacial resistance

Indexed keywords

ASPECT RATIO; COMPOSITE MATERIALS; FIBER OPTIC SENSORS; FILLED POLYMERS; FILLERS; NITRIDES; POLYMER MATRIX COMPOSITES; SILICON CARBIDE; SILICON NITRIDE; THERMAL EXPANSION;

BREAKDOWN STRENGTHS; EFFECTIVE THERMAL CONDUCTIVITY; HIGH TEMPERATURE STABILITY; HIGH THERMAL CONDUCTIVITY; INTERFACIAL RESISTANCES; LOW COEFFICIENT OF THERMAL EXPANSIONS; LOW DIELECTRIC CONSTANTS; POLYMER DIELECTRICS;

THERMAL CONDUCTIVITY;

EID: 79960510187     PISSN: 08837554     EISSN: None     Source Type: Journal    
DOI: 10.1109/MEI.2011.5954064     Document Type: Review

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