Optimizing Aerosol Jet® Printing of silver interconnects on polyimide film for embedded electronics applications

Proceedings of the International Conference of DAAAM Baltic "Industrial Engineering"

Volumn , Issue , 2012, Pages 373-379

  Verheecke, W ^a   Van Dyck, M ^b   Vogeler, F ^b   Voet, A ^b   Valkenaers, H ^b  

^a Associatie KULeuven   (Belgium)

^b NONE

Author keywords

Aerosol Jet Printing; Interconnects; Optimization

Indexed keywords

AEROSOLS; GEOMETRICAL OPTICS; IMAGE PROCESSING; OPTICAL DATA PROCESSING; OPTICAL INTERCONNECTS; OPTIMIZATION; POLYIMIDES; PRINTING;

ELECTRICAL PARAMETER; EMBEDDED ELECTRONICS; GEOMETRICAL PROPERTY; MEASURING SYSTEMS; OPTICAL IMAGE PROCESSING; PROFILE ANALYSIS; QUALITY ASPECTS; SUBMICRON SCALE;

SILVER;

EID: 84920518999     PISSN: 2346612X     EISSN: 23466138     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Hon, K. K. B., Li, L. and Hutchings, I. M. Direct writing technology-Advances and developments. Annals of the CIRP-Manufacturing Technology, 2008, 57, 601-620.
2. ® Printed Electronics Overview, New Mexico (Albuquerque) USA, [WWW] http://www.optomec.com (02.03. 2012)
3. Hedges, M. 3D MID Manufacture via the M3D Process. In Proceedings of the 8th International Congress Molded Interconnect Devices, Nuremberg Fuerth, Germany, September 24.-25. 2008.
4. Akedo, J. Microstructure of ceramic thick film formed by aerosol deposition and its applications to microactuator. Integr. Ferroelectr., 2006, 1, 55-65.
5. Brose, M. et al. Aerosol Deposition of Catalytic Ink to Fabricate Fine Pitch Metallizations for Moulded Interconnect Devices (MID). In Electronic System Integration Technology Conference (ESTC), 2010, 1-4.
6. Folgar, C. E. et al. Solution-based aerosol deposition process for synthesis of multilayer structures. Materials Letters, 2011, 65, 1302-1307.
7. Goth, C., Putzo, S., Franke, J. Aerosol Jet Printing on Rapid Prototyping Materials for Fine Pitch Electronic Applications. In Electronic Components and Technology Conference (ECTC), 2011, 1211-1216.
8. ® Multi-Nozzle Process Parameters for Non-Contact Front Side Metallization of Silicon Solar Cells. In: Photovoltaic Specialists Conference (PVSC), 34th IEEE, 2009.
9. Grunwald, I. et al. Surface biofunctionalization and production of miniaturized sensor structures using aerosol printing technologies. Biofabrication, 2010, 2, 014106.
10. Contact angle [WWW] http://www.ramehart.com/contactangle.htm (02.03. 2012)
11. O'Reilly, M and Leal, J. Jetting Your Way to Fine-pitch 3D Interconnects. In: Chip Scale Review[online], September-October 2010, 18-21.
12. Cabot Printed Electronics Materials, Datasheet CSD-32 Cabot Fine Particle Silver Ink.
13. Optomec Inc. Aerosol Jet Deposition System Manual, Albuquerque, 2010.