Aerosol deposition of catalytic ink to fabricate fine pitch metallizations for Moulded Interconnect Devices (MID)

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Brose, Andreas ^a   Leneke, Thomas ^a   Hirsch, Soeren ^a   Schmidt, Bertram ^a  

^a OTTO VON GUERICKE UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSIONAL; AEROSOL DEPOSITION; CATALYTIC MATERIALS; CIRCUIT BOARDS; DEPOSITION CHARACTERISTICS; ELECTRONIC PRODUCT; FINE PITCH; HIGH INTEGRATION DENSITY; INTERCONNECT DEVICES; LASER STRUCTURING; MECHANICAL CHARACTERISTICS; METALLIZATION PROCESS; METALLIZATIONS; PACKAGING SOLUTIONS; POLYMER DEVICES; POLYMER MATERIALS; POLYMER SUBSTRATE; SHEAR FORCE; TEMPERATURE CYCLES; VAPOUR-PHASE;

ATMOSPHERIC AEROSOLS; AUTOMOBILE ELECTRONIC EQUIPMENT; CHIP SCALE PACKAGES; CONSUMER PRODUCTS; COPPER PLATING; FLIGHT DYNAMICS; INJECTION MOLDING; POLYMERS; PROCESS ENGINEERING; RESPIRATORY MECHANICS; SEMICONDUCTING GALLIUM COMPOUNDS; THREE DIMENSIONAL;

METALLIZING;

EID: 78651298454     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642858     Document Type: Conference Paper

References (13)

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