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Volumn , Issue , 2011, Pages 1211-1216

Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applications

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATED SUBSTRATES; DIFFERENT SUBSTRATES; ELECTRONIC APPLICATION; FINE PITCH; FINE STRUCTURES; HIGH HEAT RESISTANCE; INK-JET; JET PRINTING; MASK LESS; MECHATRONIC SYSTEMS; MOLDED INTERCONNECT DEVICES; NON-CONTACT; PRINTING METHOD; PRINTING PROCESS; PRINTING TECHNOLOGIES; PROCESS PARAMETERS; RESEARCH ACTIVITIES; SOLDERING PROCESS; STAND-OFF; WETTING CHARACTERISTICS;

EID: 79960388754     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898664     Document Type: Conference Paper
Times cited : (130)

References (20)
  • 1
    • 79960435241 scopus 로고    scopus 로고
    • Molded interconnect devices - Progressive approach for mechatronic products and efficient manufacturing processes
    • Kauai, Hawaii
    • Goth, C.; Franke, J.; Feldmann, K.: "Molded Interconnect Devices - Progressive Approach for Mechatronic Products and Efficient Manufacturing Processes" Proceedings of 2010 Microelectronics Pan Pacific Symposium SMTA, Kauai, Hawaii, 2010
    • (2010) Proceedings of 2010 Microelectronics Pan Pacific Symposium SMTA
    • Goth, C.1    Franke, J.2    Feldmann, K.3
  • 2
    • 77649086579 scopus 로고    scopus 로고
    • Advanced mechatronic systems using MID (Molded Interconnect Devices) and FPC (Flexible Printed Circuits)
    • Institute of Manufacturing Engineering, National Cheng Kung University Tainan, Taiwan
    • th International Conference on Automation Technology, Institute of Manufacturing Engineering, National Cheng Kung University Tainan, Taiwan, 2009, pp. 24-29
    • (2009) th International Conference on Automation Technology , pp. 24-29
    • Feldmann, K.1    Franke, J.2    Goth, C.3
  • 4
    • 79960388242 scopus 로고    scopus 로고
    • accessed January 2011
    • www.3dmid.de, accessed January 2011
  • 16
    • 33744796236 scopus 로고    scopus 로고
    • Aerosol deposition of ceramic thick films at room temperature: Densification mechanism of ceramic layers
    • June
    • Akedo, J. "Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers" In: Journal of the American Ceramic Society. Volume 89, Issue 6, pages 1834-1839, June 2006
    • (2006) Journal of the American Ceramic Society , vol.89 , Issue.6 , pp. 1834-1839
    • Akedo, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.