Pure air-plasma bullets propagating inside microcapillaries and in ambient air

Plasma Sources Science and Technology

Volumn 23, Issue 6, 2014, Pages

  Lacoste, Deanna A ^a   Bourdon, Anne ^b   Kuribara, Koichi ^c   Urabe, Keiichiro ^c   Stauss, Sven ^c   Terashima, Kazuo ^c  

^a KING ABDULLAH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Saudi Arabia)

^b Centre National de la Recherche Scientifique   (France)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

atmospheric pressure; dielectric barrier discharge; nanosecond discharges; plasma jet

Indexed keywords

AIR; ATMOSPHERIC PRESSURE; CAPILLARY TUBES; DIELECTRIC DEVICES; DIELECTRIC MATERIALS; ELECTRIC DISCHARGES; ELECTRODES; FLOW CONTROL; FUSED SILICA; INERT GASES; PLASMA JETS;

APPLIED VOLTAGES; DIELECTRIC BARRIER DISCHARGES; INNER DIAMETERS; MICRO-CAPILLARIES; MICROCAPILLARY TUBES; NANOSECOND DISCHARGE; PLASMA BEHAVIOR; REPETITIVELY PULSED DISCHARGE;

ELECTROMAGNETIC WAVE PROPAGATION IN PLASMA;

EID: 84915747544     PISSN: 09630252     EISSN: 13616595     Source Type: Journal    
DOI: 10.1088/0963-0252/23/6/062006     Document Type: Article

References (34)

1. Teschke M, Kedzierski J, Finantu-Dinu E, Korzec D and Engemann J 2005 IEEE Trans. Plasma Sci. 33 310-11
2. Lu X and Laroussi M 2006 J. Appl. Phys. 100 063302
3. Urabe K, Morita T, Tachibana K and Ganguly B 2010 J. Phys. D: Appl. Phys. 43 095201
4. Jansky J, Algwari Q, O'Connell D and Bourdon A 2012 IEEE Trans. Plasma Sci. 40 2912-9
5. Lu X, Laroussi M and Puech V 2012 Plasma Sources Sci. Technol. 21 034005
6. O'Connell D, Cox L, Hyland W, McMahon S, Reuter S, Graham W, Gans T and Currell F 2011 Appl. Phys. Lett. 98 043701
7. Hoentsch M, von Woedtke T, Weltmann K D and Nebe J 2012 J. Phys. D: Appl. Phys. 45 025206
8. Park G, Park S, Choi M, Koo I, Byun J, Hong J, Sim J, Collins G and Lee J 2012 Plasma Sources Sci. Technol. 21 043001
9. Babayan S, Jeong J, Park J, Selwyn G and Hicks R 1998 Plasma Sources Sci. Technol. 7 286
10. Xu L, Liu P, Zhan R, Wen X, Ding L and Nagatsu M 2006 Thin Solid Films 506-507 400-3
11. Ito Y, Urabe K, Takano N and Tachibana K 2008 Appl. Phys. Express 1 067009
12. Kim H, Brockhaus A and Engemann J 2009 Appl. Phys. Lett. 95 211501
13. Bussiahn R, Kindel E, Lange H and Weltmann K 2010 J. Phys. D: Appl. Phys. 43 165201
14. Robert E, Barbosa E, Dozias S, Vandamme M, Cachoncinlle C, Viladrosa R and Pouvesle J 2009 Plasma Process. Polym. 6 795-802
15. Sarron V, Robert E, Dozias S, Vandamme M, Ries D and Pouvesle J 2011 IEEE Trans. Plasma Sci. 39 2356-7
16. Li Q, Zhu W C, Zhu X M and Pu Y K 2010 J. Phys. D: Appl. Phys. 43 382001
17. Kirkpatrick M J, Odic E, Zinola S and Lavy J 2012 Appl. Catal. B 117 1-9
18. Lacoste D and Moeck J 2014 IEEE Trans. Plasma Sci. 42 2562-3
19. Machala Z, Chladekova L and Pelach M 2010 J. Phys. D: Appl. Phys. 43 222001
20. Babaeva N Y and Naidis G 1996 J. Phys. D: Appl. Phys. 29 2423-31
21. Naidis G 2009 Phys. Rev. E 79 057401
22. Pai D Z 2008 PhD Thesis École Centrale Paris
23. Rusterholtz D L, Lacoste D A, Stancu G D, Pai D Z and Laux C O 2013 J. Phys. D: Appl. Phys. 46 464010
24. Jansky J, Le Delliou P, Tholin F, Tardiveau P, Bourdon A and Pasquiers S 2011 J. Phys. D: Appl. Phys. 44 335201
25. Jarrige J, Laroussi M and Karakas E 2010 Plasma Sources Sci. Technol. 19 065005
26. Wu S, Wang Z, Huang Q, Tan X, Lu X and Ostrikov K 2013 Phys. Plasmas 20 023503
27. Specair 3 2013 www.spectralfit.com.
28. Laux C O, Spence T G, Kruger C H and Zare R N 2003 Plasma Sources Sci. Technol. 12 125-38
29. Hofmann S, Sobota A and Bruggeman P 2012 IEEE Trans. Plasma Sci. 40 2888-99
30. Luque A, Ratushnaya V and Ebert U 2008 J. Phys. D: Appl. Phys. 41 234005
31. Xian Y, Lu X, Wu S, Chu P and Pan Y 2012 Appl. Phys. Lett. 100 123702
32. Benilov M and Naidis G 2003 J. Phys. D: Appl. Phys. 36 1834-41
33. Pancheshnyi S 2005 Plasma Sources Sci. Technol. 14 645-53
34. Tholin F and Bourdon A 2013 Plasma Sources Sci. Technol. 22 045014