Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampers

Surface and Coatings Technology

Volumn 258, Issue , 2014, Pages 174-180

  Xie, Pengcheng ^a,b   He, Peng ^a   Yen, Ying Chieh ^a   Kwak, Kwang Joo ^a   Gallego Perez, Daniel ^a   Chang, Lingqian ^a   Liao, Wei ching ^a   Yi, Allen ^a   Lee, L James ^a  

^a Ohio State University   (United States)

^b BEIJING UNIVERSITY OF CHEMICAL TECHNOLOGY   (China)

Author keywords

Carbide bonded graphene coating; Hot embossing; Microstructures; Rapid mold heating and cooling

Indexed keywords

CARBIDES; GLASS TRANSITION; GRAPHENE; HEATING; MICROMACHINING; MICROOPTICS; MICROSTRUCTURE; POLYMERS; SILICON WAFERS; SUBSTRATES;

GRAPHENE COATINGS; HIGH ELECTRICAL CONDUCTIVITY; HOT EMBOSSING TECHNIQUE; HOT-EMBOSSING; NEWLY DEVELOPED CARBIDES; POLYMER MICROSTRUCTURES; RAPID MOLD; THERMOPLASTIC POLYMER;

PLASTIC COATINGS;

EID: 84912521755     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2014.09.034     Document Type: Article

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