Fabrication of molded interconnection devices by ultrasonic hot embossing on thin polymer films

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 3, 2009, Pages 152-156

  Khuntontong, Puttachat ^a,b   Blaser, Thomas ^c   Schomburg, Werner Karl ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b RWTH AACHEN UNIVERSITY   (Germany)

^c RINCO Ultrasonics AG   (Switzerland)

Author keywords

Flexible circuit; Molded interconnect devices (MIDs); Ultrasonic hot embossing

Indexed keywords

ANTENNA CIRCUITS; CONDUCTIVE PATHS; ELECTRICAL INSULATION; FLEXIBLE CIRCUIT; FLEXIBLE MEMBRANES; HOT-EMBOSSING; INPUT DEVICES; INTERCONNECTION DEVICES; LOW COSTS; METAL LAYER; METAL PATTERNS; MOLDED INTERCONNECT DEVICES (MIDS); POLY-PROPYLENE FILM; POLYMER LAYERS; POLYMER SUBSTRATE; RADIO FREQUENCY IDENTIFICATION DEVICES; RESONANCE FREQUENCIES; THIN METAL FILMS; THIN POLYMER FILMS;

ALUMINA; ALUMINUM FOIL; ANTENNAS; CONDUCTIVE FILMS; FABRICATION; METALLIC FILMS; PLASTIC FILMS; POLYMERS; RADIO FREQUENCY IDENTIFICATION (RFID); RESONANCE; STRUCTURAL METALS; TYPEWRITER KEYBOARDS; ULTRASONICS; WELDING;

POLYMER FILMS;

EID: 68049112361     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2020742     Document Type: Article

References (14)

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