|
Volumn , Issue , 2014, Pages 1-6
|
A semiconductor memory development and manufacturing perspective
a a a a
a
Micron
(United States)
|
Author keywords
3D Integration; DRAM; Emerging Memory; NAND; NOR; Package Technology
|
Indexed keywords
ELECTRONICS INDUSTRY;
INTERNATIONAL TRADE;
MANUFACTURE;
SEMICONDUCTOR STORAGE;
SOLID STATE DEVICES;
3-D INTEGRATION;
EMERGING MEMORY;
NAND;
PACKAGE TECHNOLOGIES;
SEMICONDUCTOR MEMORY;
SYSTEM ARCHITECTURES;
TECHNOLOGY CHALLENGES;
TECHNOLOGY DEVELOPMENT;
DYNAMIC RANDOM ACCESS STORAGE;
|
EID: 84911967063
PISSN: 19308876
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESSDERC.2014.6948745 Document Type: Conference Paper |
Times cited : (3)
|
References (9)
|