Pulsed-bed atomic layer deposition setup for powder coating

Powder Technology

Volumn 267, Issue , 2014, Pages 201-207

  Tiznado, H ^a   Dominguez D ^a   Munoz Munoz F ^a   Romo Herrera, J ^a   Machorro, R ^a   Contreras, O E ^a   Soto, G ^a  

^a UNIVERSIDAD NACIONAL AUTÓNOMA DE MÉXICO   (Mexico)

Author keywords

Atomic layer deposition; Fluidization; Instrumentation; Particles; Powder; Pulsed bed

Indexed keywords

DEPOSITION; ELEMENTARY PARTICLES; FLUIDIZATION; POWDER COATINGS; POWDERS; SURFACE ROUGHNESS; THICKNESS MEASUREMENT; ULTRATHIN FILMS;

CHEMICALLY BONDED; COATING THICKNESS; CONVENIENT ALTERNATIVES; FLUIDIZATION CONDITIONS; INSTRUMENTATION; MORPHOLOGICAL CHARACTERISTIC; PARTICLE SURFACE; PULSED-BED;

ATOMIC LAYER DEPOSITION;

ALUMINUM OXIDE; CARBON NANOTUBE; TIN OXIDE; ZINC OXIDE;

ARTICLE; ATOMIC LAYER DEPOSITION REACTOR; BIOTECHNOLOGICAL PROCEDURES; CHEMICAL PARAMETERS; CHEMICAL STRUCTURE; CONTROLLED STUDY; FEASIBILITY STUDY; FLOW RATE; FLUIDIZED BED ATOMIC LAYER DEPOSITION; MATERIAL COATING; PARTICLE DENSITY; PARTICLE SIZE; POWDER COATING; PROCESS OPTIMIZATION; PULSED BED ATOMIC LAYER DEPOSITION; REACTOR; REACTOR OPTIMIZATION; RESIDENCE TIME; SHELL THICKNESS; SURFACE PROPERTY; TRANSMISSION ELECTRON MICROSCOPY;

EID: 84907333605     PISSN: 00325910     EISSN: 1873328X     Source Type: Journal    
DOI: 10.1016/j.powtec.2014.07.034     Document Type: Article

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