Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating

Materials Letters

Volumn 132, Issue , 2014, Pages 302-306

  Petukhov, Dmitrii I ^a,b   Kirikova, Marina N ^a   Bessonov, Alexander A ^a   Bailey, Marc J A ^a  

^a NOKIA RESEARCH CENTER   (United States)

^b MOSCOW STATE UNIVERSITY   (Russian Federation)

Author keywords

Copper electroless plating; Flexible electronics; Nickel electroless plating; Polymer metallization; Reactive inkjet printing

Indexed keywords

COPPER; ELECTROLESS PLATING; FLEXIBLE ELECTRONICS; INK JET PRINTING; METAL NANOPARTICLES; NICKEL; PALLADIUM; POLYMERS; SUBSTRATES;

BENDING CYCLES; CONDUCTIVE PATTERNS; FLEXIBLE ELECTRONIC DEVICES; PALLADIUM NANOPARTICLES; POLYMER METALLIZATION; POLYMER SUBSTRATE; POLYMERIC SUBSTRATE; REACTIVE INK JETS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84903987754     PISSN: 0167577X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matlet.2014.06.109     Document Type: Article

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