Effect of pi film surface on printing of pd(ii) catalytic ink for electroless copper plating in the printed electronics

Journal of Industrial and Engineering Chemistry

Volumn 18, Issue 1, 2012, Pages 290-294

  Suh, Seung Wook ^a   Kim, Jang Jung ^a   Kim, Sook Hyun ^a   Park, Byung Ki ^a  

^a Korea Research Institute of Chemical Technology   (South Korea)

Author keywords

Catalytic nuclei; Electroless plating; Pd(II) ink; Polyimide film; Printed electronics; Surface treatment

Indexed keywords

AFM; CATALYTIC NUCLEI; ELECTROLESS; ELECTROLESS COPPER PLATING; FT-IR-ATR; KOH SOLUTION; LOW VISCOSITY; PI FILM; POLYIMIDE FILM; PRINTED ELECTRONICS; STABILIZING AGENTS; STORAGE STABILITY; SUBSTRATE SURFACE; SURFACE CONDITIONS; UV-VISIBLE SPECTROPHOTOMETER; VIDEO MICROSCOPE;

CONTACT ANGLE; COPPER; COPPER PLATING; ELECTROLESS PLATING; INK; PALLADIUM COMPOUNDS; PHYSICAL PROPERTIES; POLYIMIDES; POLYMERIC FILMS; PRINTING; SURFACE TENSION; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

SURFACE PROPERTIES;

EID: 84855477731     PISSN: 1226086X     EISSN: 22345957     Source Type: Journal    
DOI: 10.1016/j.jiec.2011.11.003     Document Type: Article

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