Direct fabrication of copper patterns by reactive inkjet printing

Current Applied Physics

Volumn 13, Issue 9, 2013, Pages 1870-1873

  Kim, Kukjoo ^a   Ahn, Sung Il ^b   Choi, Kyung Cheol ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Silla University   (South Korea)

Author keywords

Copper pattern; Nozzle clogging; Reactive inkjet printing

Indexed keywords

COPPER; INK JET PRINTING; NOZZLES; PRINTING; REDUCING AGENTS;

COPPER PATTERN; CU NANO-PARTICLES; DIRECT FABRICATIONS; NOZZLE CLOGGING; PROCESS COSTS; REACTIVE INK JETS; REACTIVE INKS; REACTIVE PRECURSORS;

INK;

EID: 84891873049     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2013.07.021     Document Type: Article

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