Novel lamination and interconnection technologies demonstrated in a flexible modular optical sensor array for wound monitoring

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 769-772

  van den Brand, Jeroen ^a   Saalmink, Milan ^a   Barink, Marco ^a   Dietzel, Andreas ^a  

^a TNO   (Netherlands)

Author keywords

Flexible foils; Interconnection; Lamination

Indexed keywords

ADHESIVE FILM; ALL-PRINTED; COST EFFECTIVE; ELECTRICAL INTERCONNECTS; EMERGING TECHNOLOGIES; INTERCONNECTION TECHNOLOGY; ISOTROPIC CONDUCTIVE ADHESIVES; OPTIMISATIONS; PRINTED ELECTRONICS; PROCESSING STEPS; SMART ELECTRONICS; STRUCTURAL BONDING; SUBSTRATE MATERIAL;

CONDUCTIVE FILMS; ELECTRONICS INDUSTRY; LAMINATING; OPTICAL SENSORS; SENSOR ARRAYS;

FLEXIBLE ELECTRONICS;

EID: 76949095494     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.11.121     Document Type: Article

References (6)

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