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Volumn , Issue , 2008, Pages 315-320
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Industrial and technical aspects of chip embedding technology
a
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Author keywords
Chip embedding; Industrialisation of embedding; Ultra fine line patterning
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Indexed keywords
CHIP EMBEDDING;
CONCURRENT DEVELOPMENTS;
DIE ASSEMBLIES;
ELECTRICAL PERFORMANCES;
EMBEDDED COMPONENTS;
EMBEDDING TECHNOLOGIES;
INDUSTRIALISATION OF EMBEDDING;
INTER-CONNECTS;
MANUFACTURING CHALLENGES;
MANUFACTURING PLANTS;
MANUFACTURING PROCESSES;
MECHANICAL ENVIRONMENTS;
MULTIPLE LAYERS;
ORGANIC SUBSTRATES;
PRODUCTION LINES;
SEMICONDUCTOR CHIPS;
TECHNICAL ASPECTS;
TESTING METHODOLOGIES;
THIN CHIPS;
ULTRA FINE LINE PATTERNING;
ASSEMBLY MACHINES;
ELECTRONIC EQUIPMENT MANUFACTURE;
INDUSTRIAL ENGINEERING;
MANUFACTURE;
MODERNIZATION;
POLYCHLORINATED BIPHENYLS;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
PRINTED CIRCUITS;
PRODUCTION ENGINEERING;
SEMICONDUCTING ORGANIC COMPOUNDS;
SUPPLY CHAINS;
TECHNOLOGY;
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EID: 58149098532
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ESTC.2008.4684368 Document Type: Conference Paper |
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Times cited : (32)
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References (5)
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