Effect of heat treatment on the thermoelectric properties of bismuth-antimony-telluride prepared by mechanical deformation and mechanical alloying

Journal of Electronic Materials

Volumn 43, Issue 6, 2014, Pages 2255-2261

  Lee, Deuk Hee ^a   Lee, Jae Uk ^a   Jung, Sung Jin ^a   Baek, Seung Hyub ^a   Kim, Ju Heon ^a   Kim, Dong Ik ^a   Hyun, Dow Bin ^a   Kim, Jin Sang ^a  

^a Korea Institute of Science and Technology   (South Korea)

Author keywords

Bismuth antimony telluride; mechanical alloying; mechanical deformation; powder metallurgy; thermoelectric property

Indexed keywords

ANNEALING; ANTIMONY ALLOYS; ANTIMONY COMPOUNDS; ANTIMONY METALLURGY; BISMUTH METALLURGY; DEFORMATION; ELECTRIC CONDUCTIVITY; MECHANICAL ALLOYING; POWDER METALLURGY; SEEBECK COEFFICIENT; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY;

ANNEALING TIME; BISMUTH ANTIMONY TELLURIDE; EFFECT OF HEAT TREATMENTS; FIGURE OF MERITS; FIGURES OF MERITS; MECHANICAL DEFORMATION; THERMOELECTRIC MATERIAL; THERMOELECTRIC PROPERTIES;

BISMUTH COMPOUNDS;

EID: 84901916732     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-014-3037-1     Document Type: Article

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