Functionalized KIT-6/Terpolyimide composites with ultra-low dielectric constant

Journal of Applied Polymer Science

Volumn 131, Issue 15, 2014, Pages

  Purushothaman, Revathi ^a   Palanichamy, Muthiapillai ^b   Mohammed Bilal, I ^a  

^a B S ABDUR RAHMAN CRESCENT INSTITUTE OF SCIENCE AND TECHNOLOGY   (India)

^b ANNA UNIVERSITY   (India)

Author keywords

composites; dielectric properties; films; polyimides; porous materials

Indexed keywords

COMPOSITE MATERIALS; DIELECTRIC PROPERTIES; FILMS; MICROELECTRONICS; POLYIMIDES; POROUS MATERIALS; PRINTED CIRCUITS; TENSILE STRENGTH;

3-AMINOPROPYLTRIETHOXYSILANE; BENZOPHENONETETRACARBOXYLIC DIANHYDRIDE; FLEXIBLE PRINTED CIRCUIT; FLEXIBLE PRINTED CIRCUIT BOARDS; HIGH THERMAL STABILITY; LOW DIELECTRIC CONSTANTS; MICROELECTRONIC APPLICATIONS; ULTRA-LOW DIELECTRIC CONSTANT;

DIELECTRIC PROPERTIES OF SOLIDS;

EID: 84900518804     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.40508     Document Type: Article

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