Tiny MEMS-based pressure sensors in the measurement of Intracranial Pressure

Tsinghua Science and Technology

Volumn 19, Issue 2, 2014, Pages 161-167

  Zhang, Yanhang ^a   Zhang, Zhaohua ^b   Pang, Bo ^a   Yuan, Li ^a   Ren, Tianling ^a  

^a TSINGHUA UNIVERSITY   (China)

^b INSTITUTE OF GEOLOGY AND GEOPHYSICS   (China)

Author keywords

finite element analysis; intracranial pressure; tiny sensors

Indexed keywords

FINITE ELEMENT METHOD;

INTRA-CRANIAL PRESSURE; MECHANICAL SYSTEMS; PIEZORESISTIVE EFFECTS; PIEZORESISTIVE PRESSURE SENSORS; RELATIVE ERRORS; SENSOR CHIPS;

PRESSURE SENSORS;

EID: 84899622501     PISSN: 10070214     EISSN: None     Source Type: Journal    
DOI: 10.1109/TST.2014.6787369     Document Type: Article

References (14)

1. M. Chopp and H. D. Portnoy, System analysis of intracranial pressure: Comparison with volume-pressure test and CSF-pulse amplitude analysis, Journal of Neurosurgery, vol. 53, no. 4, pp. 516-527, 1980. (Pubitemid 10003560)
2. M. Elwenspoek and J. Wiegerink, Mechanical Microsensors. Springer, 2001.
3. A. Ginggen, Y. Tardy, and R. Crivelli, A telemetric pressure sensor system for biomedical applications, Biomedical Engineering, IEEE Transactions on, vol. 55, no. 4, pp. 1374-1381, 2008. (Pubitemid 351440497)
4. S. S. Basati, T. J. Harris, and A. A. Linninger, Dynamic brain phantom for intracranial volume measurements, Biomedical Engineering, IEEE Transactions on, vol. 58, no. 5, pp. 1450-1455, 2011.
5. L. Lin, H. Chu, and Y. Lu, A simulation program for the sensitivity and linearity of piezoresistive pressure sensors, Microelectromechanical Systems, vol. 8, no. 4, pp. 514-522, 1999. (Pubitemid 30552580)
6. W. D. Nix, Mechanical properties of thin films, Metallurg. Trans. A, vol. 20A, pp. 2217-2245, 1989.
7. L. Zhao, C. Xu, and G. Shen, Analysis for load limitation of square shaped silicon diaphragms, Solid-State Electronics, vol. 50, pp. 1579-1583, 2006.
8. L. Lin and W. Yang, Design, optimization and fabrication of surface micromachined pressure sensors, Mechatronics, vol. 8, no. 5, pp. 505-519, 1998. (Pubitemid 128416273)
9. B. Bae, R. Flachsbart, K. Park, and A. Shannon, Design optimization of a piezoresistive pressure sensor considering the output signal to-noise ratio, Micromechanics and Microengineering, vol. 14, no. 12, pp. 1597-1607, 2004. (Pubitemid 40002281)
10. S. Keshner, 1/F noise, Proceedings of The IEEE, vol. 70, no. 3, pp. 212-218, 1982.
11. J. A. Chiou and S. Chen, Thermal hysteresis analysis of MEMS pressure sensors, Microelectromechanical Systems, vol. 14, pp. 782-787, 2005. (Pubitemid 41488597)
12. R. Krondorfer, Y. K. Kim, J. Kim, C. G. Gusstafson, and T. C. Lommasson, Finite element simulation of package stress in transfer molded MEMS pressure sensors, Microelectronics Reliability, vol. 44, pp. 1995-2002, 2004.
13. M. Narayanaswamy, R. Joseph Daniel, K. Sumangala, and C. Jayasehar, Computer aided modeling and diaphragm design approach for high sensitivity silicon-on-insulator pressure sensors, Measurement, vol. 44, no. 10, pp. 1924-1936, 2011.
14. S. M. Sze, Semiconductor Sensors. New York, USA: J. Wiley and Sons. Inc, 1994.