The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation

Scientific Reports

Volumn 4, Issue , 2014, Pages

  Zhou, Yongcun ^a,b   Yao, Yagang ^b,c   Chen, Chia Yun ^b   Moon, Kyoungsik ^b   Wang, Hong ^a   Wong, Ching Ping ^b,d  

^a XI'AN JIAOTONG UNIVERSITY   (China)

^b Georgia Institute of Technology   (United States)

^c SUZHOU INSTITUTE OF NANO TECH AND NANO BIONICS   (China)

^d CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84899481845     PISSN: None     EISSN: 20452322     Source Type: Journal    
DOI: 10.1038/srep04779     Document Type: Article

References (46)

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