Materials science: Triangular and Fibonacci number patterns driven by stress on core/shell microstructures

Science

Volumn 309, Issue 5736, 2005, Pages 909-911

  Li, Chaorong ^a   Zhang, Xiaona ^a   Cao, Zexian ^a  

^a INSTITUTE OF PHYSICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; MICROSTRUCTURE; SELF ASSEMBLY; SHELLS (STRUCTURES); STRESSES;

FIBONACCI NUMBER PATTERNS; STRAIN ENERGY; STRESS ENGINEERING;

MATERIALS SCIENCE;

SILICON DERIVATIVE; SILICON OXIDE; SILVER; UNCLASSIFIED DRUG;

NUMERICAL METHOD;

ARTICLE; COOLING; ENERGY; ENGINEERING; GEOMETRY; IMAGE ANALYSIS; NONHUMAN; PARAMETER; PARTICLE SIZE; PLANT; PRIORITY JOURNAL; RIGIDITY; SCANNING ELECTRON MICROSCOPY; STRESS; STRUCTURE ANALYSIS; SURFACE PROPERTY; TEMPERATURE DEPENDENCE; THICKNESS; BIOLOGICAL MODEL; BIOPHYSICS; HISTOLOGY; MORPHOGENESIS; ULTRASTRUCTURE;

BIOPHYSICS; BODY PATTERNING; MODELS, BIOLOGICAL; PLANTS; SILICON COMPOUNDS; SILVER;

EID: 23244460695     PISSN: 00368075     EISSN: None     Source Type: Journal    
DOI: 10.1126/science.1113412     Document Type: Article

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19. We acknowledge support from the China State Key Projects of Basic Research (grant 2002CB613500), the National High Technology Research and Development Program of China (grant 2003AA302170), and the National Natural Science Foundation of China (grants 60306009, 50472070, and 50272081).