Current progress on pixel level packaging for uncooled IRFPA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8353, Issue , 2012, Pages

  Dumont, G ^a   Rabaud, W ^a   Yon, J J ^a   Carle, L ^a   Goudon, V ^a   Vialle, C ^a   Becker, Sébastien ^a   Hamelin, Antoine ^a   Arnaud, A ^a  

^a CEA LETI   (France)

Author keywords

collective packaging; high volume; micro bolometer; Pixel Level Packaging; uncooled IRFPA

Indexed keywords

BOLOMETERS; INFRARED RADIATION; PIXELS; READOUT SYSTEMS; TEMPERATURE SENSORS; VACUUM;

HIGH VOLUMES; INFRA-RED CAMERAS; MICROBOLOMETER; OPTICAL EFFICIENCY; OPTICAL PERFORMANCE; PIXEL LEVEL; TECHNOLOGICAL BREAKTHROUGHS; UNCOOLED IRFPA;

PACKAGING;

EID: 84899419161     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.919918     Document Type: Conference Paper

References (7)

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