Pixel level packaging for uncooled IRFPA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 8012, Issue , 2011, Pages

  Dumont, G ^a   Rabaud, W ^a   Baillin, X ^a   Pornin, J L ^a   Carle, L ^a   Goudon, V ^a   Vialle, C ^a   Pellat, M ^a   Arnaud, A ^a  

^a CEA GRENOBLE   (France)

Author keywords

IRFPA; Low cost; Micro bolometer; Pixel level packaging; Thin film getters

Indexed keywords

FILM GETTERS; IRFPA; LIFE SPAN; LOW COSTS; MICROBOLOMETER; PACKAGING PROCESS; PACKAGING TECHNOLOGIES; PIXEL LEVEL; THIN FILM GETTERS; UNCOOLED IR DETECTORS; UNCOOLED IRFPA;

BOLOMETERS; GETTERS; INFRARED DETECTORS; INFRARED RADIATION; INNOVATION; METALS; PIXELS; TECHNOLOGY; THIN FILMS; VACUUM;

PACKAGING;

EID: 80053047059     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.883852     Document Type: Conference Paper

References (3)

1. Dumont G. et al, "Innovative on-chip packaging applied to uncooled IRFPA", Infrared technology and Applications XXXIV, Proc. SPIE Vol. 6940, 69401Y (2008).
2. Vilain M., "Procédés et dispositifs de fabrication de détecteurs de rayonnement", FR 2 822 541 French Patent, (2001).
3. Rabaud W. et al, "Recent development in pixel level packaging for IRFPA", Electro-Optical and Infrared Systems: Technology and Applications VII, Proc. SPIE Vol.7834, 78340T (2010).