Innovative on-chip packaging applied to uncooled IRFPA

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6940, Issue , 2008, Pages

  Dumont, Geoffroy ^a   Arnaud, Agnès ^a   Impérinetti, Pierre ^a   Vialle, Claire ^a   Rabaud, Wilfried ^a   Goudon, Valérie ^a   Yon, Jean Jacques ^a  

^a CEA LETI   (France)

Author keywords

Microbolometer; Vacuum packaging

Indexed keywords

BOLOMETERS; CHIP SCALE PACKAGES; COMPUTER NETWORKS; DETECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; INFRARED RADIATION; IRIDIUM; METEOROLOGICAL INSTRUMENTS; PACKAGING; PIGMENTS; STANDARDS; STRUCTURE (COMPOSITION); TECHNOLOGY; VACUUM APPLICATIONS; WINDOWS;

(OTDR) TECHNOLOGY; APPLIED (CO); GENERATIONS OF TECHNOLOGY; INFRARED TECHNOLOGIES; IR WINDOW; LOW COSTS; MICROBOLOMETERS; ON-CHIP PACKAGING; OPTICAL SIMULATIONS; PACKAGING TECHNOLOGIES; PRODUCTION COSTS; SEALING LAYERS; UNCOOLED IRFPA; VACUUM LEVELS;

ELECTRONICS PACKAGING;

EID: 45549101974     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.780433     Document Type: Conference Paper

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