Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitors

1998 28th European Microwave Conference, EuMC 1998

Volumn 1, Issue , 1998, Pages 642-647

  Inoue, Koh ^a   Kamogawa, Kenji ^a   Nishikawa, Kenjiro ^a   Ikuta, Kenji ^a   Onodera, Kiyomitsu ^a   Hirano, Makoto ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVITY; THREE DIMENSIONAL;

BENZOCYCLOBUTENE; CHIP SIZES; INP DEVICES; INTERLEVEL DIELECTRIC; LOW- TEMPERATURE PROCESS; SI DEVICES; THREEDIMENSIONAL (3-D); WIDE FREQUENCY RANGE;

CAPACITORS;

EID: 84897546363     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1998.338062     Document Type: Conference Paper

References (9)

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