Highly integrated 3-D MMIC technology being applied to novel masterslice GaAs- and Si-MMIC's

Technical Digest - GaAs IC Symposium (Gallium Arsenide Integrated Circuit)

Volumn , Issue , 1996, Pages 151-154

  Tokumitsu, Tsuneo ^a   Hirano, Makoto ^a   Yamasaki, Kimiyoshi ^a   Yamaguchi, Chikara ^a   Aikawa, Masayoshi ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLIFIERS (ELECTRONIC); INTEGRATED CIRCUIT LAYOUT; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE STRUCTURES; SIGNAL RECEIVERS; THREE DIMENSIONAL;

REACTIVE IMPEDANCE MATCHING AMPLIFIER; SINGLE CHIP RECEIVER;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0030401733     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)