Novel fabrication technology for ultra-compact three-dimensional MMICs

European Solid-State Device Research Conference

Volumn , Issue , 1997, Pages 280-283

  Sugitani, Suehiro ^a   Onodera, Kiyomitsu ^a   Aoyama, Shinji ^a   Hirano, Makoto ^a   Yamasaki, Kimiyoshi ^a  

^a System Electronics Laboratories   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROMAGNETIC INDUCTION; PLASMA ETCHING;

DOUBLE LAYERS; FABRICATION TECHNOLOGIES; INTERCONNECTION STRUCTURE; INTERCONNECTION TECHNOLOGY; THREE-DIMENSIONAL (3D) MMICS;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 84897494196     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.1997.194420     Document Type: Conference Paper

References (6)

1. M.W. Green et aI., "Miniature multilayer spiral inductors for GaAs MMIC's, " in IEEE GaAs I C Symp., p. 303 (1989).
2. T. Tsen et aI., "0.5 um AIGaAs/GaAs HMESFET technology for digitl VLSI products, " in IEEE GaAs IC Symp., p. 193 (1993).
3. M. Hirano et aI., "Folded U-shaped microwire technology for GaAs IC intercnnections, " in IEEE GaAs IC Symp., p. 17 (1992).
4. M. Hirano et. aI., "Three-dimensional passive crcuit technology for ultr-compact MMIC's, " IEEE Trans. on MTI, vol. 4, p. 2845 (1995).
5. Toyoda et aI., "Three-dimensional MMIC and its application: A ultra-wide band miniature balun, " IEICE Trans. Electon, E78-C, No. 8, p. 919 (1995).
6. T. Tokumitsu et aI., "Highly integrated 3-D MMIC technology being applied to novel masterslic GaAs-and Si-MMIC's, " in IEEE GaAs IC Symp., (1996).