Thermal-stability comparison of glass- and silicone-based high-power phosphor-converted white-light-emitting diodes under thermal aging

IEEE Transactions on Device and Materials Reliability

Volumn 14, Issue 1, 2014, Pages 4-8

  Tsai, Chun Chin ^a,b,c   Cheng, Wei Chih ^a,d   Chang, Jin Kai ^a   Huang, Shun Yuan ^a   Liou, Jyun Sian ^a   Chen, Gi Hung ^a   Huang, Yi Chung ^a   Wang, Jau Sheng ^a   Cheng, Wood Hi ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

^b FAR EAST UNIVERSITY   (Taiwan)

^c Naval Academy   (Taiwan)

^d NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

Aging test; high power light emitting diodes (LED) modules; Phosphor layer

Indexed keywords

DIODES; FLUORESCENCE; GLASS; LIGHT EMISSION; PHOSPHORS; SILICONES; TESTING; THERMAL AGING; THERMODYNAMIC STABILITY;

ACCELERATED THERMAL AGING; AGING TESTS; FLUORESCENCE SPECTROPHOTOMETER; HIGH-POWER LIGHT-EMITTING DIODES; MEAN TIME TO FAILURE; PHOSPHOR LAYERS; SOLID STATE LIGHTING; WHITE LIGHT EMITTING DIODES;

LIGHT EMITTING DIODES;

EID: 84896458078     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2012.2206813     Document Type: Article

References (11)

1. Y. C. Hsu, Y. K. Lin, M. H. Chen, C. C. Tsai, J. H. Kuang, S. B. Huang, H. L. Hu, Y. I. Su, and W. H. Cheng, "Failure mechanisms associated with lens shape of high-power LED modules in aging test," IEEE Trans. Electron Devices, vol. 55, no. 2, pp. 689-694, Feb. 2008.
2. C. C. Tsai, M. H. Chen, Y. C. Huang, Y. C. Hsu, Y. T. Lo, Y. J. Lin, J. H. Kuang, S. B. Huang, H. L. Hu, Y. Su, and W. H. Cheng, "Decay mechanisms of radiation pattern and optical spectrum of high-power LED modules in aging test," IEEE J. Sel. Topics Quantum Electron., vol. 15, no. 4, pp. 1156-1162, Jul./Aug. 2009.
3. J. Wang, C. C. Tsai, W. C. Cheng, M. H. Chen, C. H. Chung, and W. H. Cheng, "High thermal stability of phosphor-converted white-lightemitting diodes employing Ce:YAG doped glass," IEEE J. Sel. Topics Quantum Electron., vol. 17, no. 3, pp. 741-746, May/Jun. 2011.
4. J. S.Wang, J. S. Liou, C. C. Tsai,W. C. Cheng, S. Y. Huang, G. H. Chang, and W. H. Cheng, "Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests," Microelectron. Reliab., vol. 52, no. 5, pp. 813-817, May 2012.
5. E. F. Schubert, Light-Emitting Diodes. New York: Cambridge Univ. Press, 2006, ch. 11.
6. T. Yanagisawa and T. Kojima, "Long-term accelerated current operation of white light-emitting diodes," J. Luminesc., vol. 114, no. 1, pp. 39-42, Jul. 2005. (Pubitemid 40845053)
7. Trace Pro User Guide, Lambda Research Corp., Littleton, MA, 1995, Trace Pro 3.2.2.
8. J. P. Holman, Heat Transfer, 8th ed. New York: McGraw-Hill, 2000.
9. Silicone Encapsulant for Photo ICs KER-2500/KER-2600, Shin-Etsu Chemical Company, Tokyo, Japan, 2006.
10. J. P. Klein and A. P. Basu, "Accelerated life test under competing Weibull causes of failure," Commun. Stat. Theory Meth., vol. 11, no. 20, pp. 2271-2286, 1982.
11. H. Hirose, "Maximum likelihood estimation in the 3-parameter Weibull distribution-A look through the generalized extreme-value distribution," IEEE Trans. Dielect. Elect. Insul., vol. 3, no. 1, pp. 43-55, Feb. 1996. (Pubitemid 126776789)