Encapsulate-and-peel: Fabricating carbon nanotube CMOS integrated circuits in a flexible ultra-thin plastic film

Nanotechnology

Volumn 25, Issue 6, 2014, Pages

  Gao, Pingqi ^a,b   Zhang, Qing ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING   (China)

Author keywords

carbon nanotubes; flexible electronics; integrated circuits

Indexed keywords

AVERAGE MOBILITY; HARD SUBSTRATE; INTEGRATED CIRCUITS (ICS); NEW APPROACHES; P AND N TYPES; SOFT SUBSTRATES; SUBTHRESHOLD SLOPE; SWITCHING SPEED;

CARBON NANOTUBES; CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUITS; SINGLE-WALLED CARBON NANOTUBES (SWCN); SUBSTRATES;

FLEXIBLE ELECTRONICS;

EID: 84892912595     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/25/6/065301     Document Type: Article

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