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Volumn 32, Issue 1, 2014, Pages

Adhesion testing of atomic layer deposited TiO2 on glass substrate by the use of embedded SiO2 microspheres

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TESTING; ATOMIC LAYER DEPOSITED; CRITICAL STRESS; ENERGY DISPERSIVE X RAY SPECTROSCOPY; GLASS SUBSTRATES; IMAGE ANALYSIS SOFTWARE; MECHANICAL ADHESION; MECHANICAL PARAMETERS;

EID: 84891782240     PISSN: 07342101     EISSN: 15208559     Source Type: Journal    
DOI: 10.1116/1.4827197     Document Type: Article
Times cited : (7)

References (13)
  • 1
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    • S. M. George, Chem. Rev. 110, 111 (2010). 10.1021/cr900056b
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    • George, S.M.1
  • 2
    • 21744444606 scopus 로고    scopus 로고
    • Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process
    • DOI 10.1063/1.1940727, 121301
    • R. L. Puurunen, J. Appl. Phys. 97, 121301 (2005). 10.1063/1.1940727 (Pubitemid 40940570)
    • (2005) Journal of Applied Physics , vol.97 , Issue.12 , pp. 1-52
    • Puurunen, R.L.1
  • 5
    • 0037039675 scopus 로고    scopus 로고
    • Interfacial toughness measurements for thin films on substrates
    • DOI 10.1016/S1359-6454(01)00354-8, PII S1359645401003548
    • A. A. Volinsky, N. R. Moody, and W. W. Gerberich, Acta Mater. 50, 441 (2002). 10.1016/S1359-6454(01)00354-8 (Pubitemid 34064992)
    • (2002) Acta Materialia , vol.50 , Issue.3 , pp. 441-466
    • Volinsky, A.A.1    Moody, N.R.2    Gerberich, W.W.3
  • 7
    • 78650652281 scopus 로고    scopus 로고
    • 10.1088/0022-3727/44/3/034001
    • J. Chen and S. J. Bull, J. Phys. D: Appl. Phys. 44, 034001 (2011). 10.1088/0022-3727/44/3/034001
    • (2011) J. Phys. D: Appl. Phys. , vol.44 , pp. 034001
    • Chen, J.1    Bull, S.J.2
  • 8
    • 84891820914 scopus 로고    scopus 로고
    • Aluminum oxide from trimethylaluminum and water by atomic layer deposition: Residual stress, elastic modulus, hardness and adhesion
    • (submitted)
    • O. M. E. Ylivaara, " Aluminum oxide from trimethylaluminum and water by atomic layer deposition: Residual stress, elastic modulus, hardness and adhesion.," Thin Solid Films (submitted).
    • Thin Solid Films
    • Ylivaara, O.M.E.1
  • 11
    • 84891817134 scopus 로고    scopus 로고
    • Nanogalax Oy, Piispanristi, Finland, see:, last accessed July 20
    • Nanogalax Oy, Piispanristi, Finland, see: http://www.nanogalax.com/, last accessed July 20, 2013.
    • (2013)
  • 13
    • 84870065121 scopus 로고    scopus 로고
    • 10.1016/j.sna.2012.05.006
    • R. L. Puurunen, Sens. Actuators A 188, 268 (2012). 10.1016/j.sna.2012.05. 006
    • (2012) Sens. Actuators A , vol.188 , pp. 268
    • Puurunen, R.L.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.