Limit for thermal transport reduction in Si nanowires with nanoengineered corrugations

Applied Physics Letters

Volumn 103, Issue 24, 2013, Pages

  Sullivan, Sean E ^a,b   Lin, Keng Hua ^a   Avdoshenko, Stanislav ^a   Strachan, Alejandro ^a  

^a PURDUE UNIVERSITY   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONDUCTANCE REDUCTION; CORRUGATION HEIGHTS; HEAT CURRENTS; NON EQUILIBRIUM MOLECULAR DYNAMIC (NEMD); PERIODIC CORRUGATION; SPATIALLY RESOLVED; THERMAL CONDUCTANCE; THERMAL TRANSPORT;

MOLECULAR DYNAMICS; NANOWIRES;

SILICON;

EID: 84890478526     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4844995     Document Type: Article

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