Antimicrobial and decorative ion-plated copper-containing ceramic coatings

Surface and Coatings Technology

Volumn 236, Issue , 2013, Pages 29-35

  Chen, Nan Hung ^a   Chung, Chi Jen ^b   Chiang, Chung Chien ^c   Chen, Keh Chang ^a   He, Ju Liang ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b CENTRAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Antimicrobial; Arc ion plating (AIP); Copper containing titanium nitride (Cu containing TiN); Decorative hard coating; Magnetron sputtering (MS); Microstructure

Indexed keywords

ANTI-MICROBIAL PROPERTIES; ANTIMICROBIAL; ANTIMICROBIAL FUNCTIONS; ARC ION PLATING; COPPER-CONTAINING TITANIUM NITRIDE (CU-CONTAINING TIN); ESCHERICHIA COLI (E. COLI); GRANULAR STRUCTURESS; TITANIUM NITRIDE COATING;

CERAMIC COATINGS; COPPER; CORROSION RESISTANCE; ESCHERICHIA COLI; HARD COATINGS; ION IMPLANTATION; MAGNETRON SPUTTERING; MICROORGANISMS; MICROSTRUCTURE; SUBSTRATES; WEAR RESISTANCE; ZINC;

TITANIUM NITRIDE;

EID: 84888835616     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2013.04.012     Document Type: Article

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