Qualification of encapsulation materials for module-level-processing

Solar Energy Materials and Solar Cells

Volumn 120, Issue PART A, 2014, Pages 396-401

  Steckenreiter, Verena ^a   Horbelt, Renate ^a   Wright, Daniel Nilsen ^b   Nese, Martin ^b   Brendel, Rolf ^a,c  

^a INSTITUTE FOR SOLAR ENERGY RESEARCH HAMELIN ISFH   (Germany)

^b REC Wafer AS   (Norway)

^c LEIBNIZ UNIVERSITY HANNOVER   (Germany)

Author keywords

Module level processing; PECVD process; Silicones; Substrate; Thin Si layers; Wafer hybrid Si technology

Indexed keywords

CELL INTERCONNECTION; CELL PROCESSING; EFFICIENT SURFACE; MODULE-LEVEL-PROCESSING; SI LAYER; THERMAL EXPOSURE; ULTRATHIN SILICON; UV IRRADIATION;

ADHESIVES; GLASS; LIQUIDS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON; SILICONES; SUBSTRATES;

SILICON WAFERS;

EID: 84888322267     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2013.06.012     Document Type: Article

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