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Volumn 27, Issue , 2012, Pages 604-609
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Introducing XIS, a new integrated device and module concept
a
TNO
(Netherlands)
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Author keywords
Back contact; Heterojunction; Module concept; Thin wafers
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Indexed keywords
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EID: 84888366067
PISSN: 18766102
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1016/j.egypro.2012.07.117 Document Type: Conference Paper |
Times cited : (3)
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References (6)
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