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Volumn 27, Issue , 2012, Pages 604-609

Introducing XIS, a new integrated device and module concept

Author keywords

Back contact; Heterojunction; Module concept; Thin wafers

Indexed keywords


EID: 84888366067     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2012.07.117     Document Type: Conference Paper
Times cited : (3)

References (6)
  • 2
    • 84855306679 scopus 로고    scopus 로고
    • The approaches for high efficiency hit solar cell with very thin (< 100 m) silicon wafer over 23%
    • Kinoshita T, Fujishima D, Yano A, Ogana A, Tohoda S, Matsuyama K, et al. The approaches for high efficiency hit solar cell with very thin (< 100 m) silicon wafer over 23%. Proc. 26th EPVSEC 2011; 871-4.
    • (2011) Proc. 26th EPVSEC , pp. 8-714
    • Kinoshita, T.1    Fujishima, D.2    Yano, A.3    Ogana, A.4    Tohoda, S.5    Matsuyama, K.6
  • 5
    • 84869395401 scopus 로고    scopus 로고
    • Laser micromachining in 3D and large area applications
    • Holmes A, Pedder J. Laser micromachining in 3D and large area applications. The Industrial Laser User 2006;45;27-9.
    • (2006) The Industrial Laser User , vol.45 , pp. 2-79
    • Holmes, A.1    Pedder, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.