SCOPUS 정보 검색 플랫폼

2007 Proceedings - 24th International VLSI Multilevel Interconnection Conference, VMIC 2007

Volumn , Issue , 2007, Pages 223-230

3D integration-past, present and future

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; DEVICE INTEGRATION; FUNCTIONAL LAYER; JOINING TECHNOLOGY; MICRO ELECTROMECHANICAL SYSTEM (MEMS); MICRO-ELECTRONIC DEVICES; PROCESS ELEMENTS; SINGLE-CHIP MODULES;

JOINING; MEMS; MICROELECTRONICS; THREE DIMENSIONAL;

INTEGRATION;

EID: 84888234190 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (1)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.