Novel packaging solutions for GaN power electronics: Silver-diamond composite packages

2010 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2010

Volumn , Issue , 2010, Pages

  Faqir, M ^a   Batten, T ^a   Mrotzek, T ^b   Knippscheer, S ^b   Chalumeau, L ^c   Massiot, M ^c   Buchta, M ^d   Thorpe, J ^d   Blanck, H ^d   Rochette, S ^e   Vendier, O ^e   Kuball, M ^a  

^a UNIVERSITY OF BRISTOL   (United Kingdom)

^b PLANSEE SE   (Austria)

^c Egide Site Industriel du Sactar ^*  (France)

^d United Monolithic Semiconductors GmbH   (Germany)

^e THALES ALENIA SPACE   (France)

Author keywords

Diamond composites; GaN; Thermal conductivity; Thermal management; Thermal modeling

Indexed keywords

DEVICE TEMPERATURE; DIAMOND COMPOSITES; GAN; HIGH-POWER DEVICES; OPERATING POWER; PACKAGING SOLUTIONS; PACKAGING TECHNOLOGIES; THERMAL MODEL;

DIAMONDS; GALLIUM NITRIDE; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SILVER; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY;

PACKAGING;

EID: 84887326158     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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3. R. Bollina and S. Knippscheer "Advanced Metal Diamond Composites - Love and Heat Relationship, " ElectronicsCooling, November 2008.
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