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Volumn , Issue , 2006, Pages 644-649

Accurate thermal analysis considering nonlinear thermal conductivity

Author keywords

[No Author keywords available]

Indexed keywords

ABSTRACTION LEVEL; LINEAR SYSTEM OF EQUATIONS; NONLINEAR DEPENDENCE; NONLINEAR FUNCTIONS; PACKING DENSITY; PERIODIC SOURCE; POWER DENSITIES; THERMAL PROFILES;

EID: 84886743856     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2006.20     Document Type: Conference Paper
Times cited : (5)

References (9)
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    • (2003) ISLPED , pp. 78-83
    • Su, H.1    Liu, F.2    Devgan, A.3    Acar, E.4    Nassif, S.5
  • 4
    • 0027850837 scopus 로고
    • Electrothermal simulation of integrated circuits
    • S.-S. Lee and D. J. Allstot, "Electrothermal simulation of integrated circuits," JSSC, pp. 1283-1293, 1993.
    • (1993) JSSC , pp. 1283-1293
    • Lee, S.-S.1    Allstot, D.J.2
  • 5
    • 0032139246 scopus 로고    scopus 로고
    • ILLIADS-T: An electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips
    • Y.-K. Cheng, P. Raha, C.-C. Teng, E. Rosenbaum, and S.-M. Kang, "ILLIADS-T: An electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips," TCAD, pp. 668-681, 1998.
    • (1998) TCAD , pp. 668-681
    • Cheng, Y.-K.1    Raha, P.2    Teng, C.-C.3    Rosenbaum, E.4    Kang, S.-M.5
  • 6
    • 0033712218 scopus 로고    scopus 로고
    • Fast temperature calculation for transient electrothermal simulation by mixed frequency/ time domain thermal model reduction
    • C.-H. Tsai and S.-M. Kang, "Fast temperature calculation for transient electrothermal simulation by mixed frequency/ time domain thermal model reduction," in DAC, 2000, pp. 750-755.
    • (2000) DAC , pp. 750-755
    • Tsai, C.-H.1    Kang, S.-M.2
  • 7
    • 0141527489 scopus 로고    scopus 로고
    • Thermal ADI: A lineartime chip level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method
    • T.-Y. Wang and C. C.-P. Chen, "Thermal ADI: A lineartime chip level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method," TVLSI, pp. 691-700, 2003.
    • (2003) TVLSI , pp. 691-700
    • Wang, T.-Y.1    Chen, C.C.-P.2
  • 8
    • 16244394515 scopus 로고    scopus 로고
    • Efficient full-chip thermal modeling and analysis
    • P. Li, L. T. Pileggi, M. Asheghi, and R. Chandra, "Efficient full-chip thermal modeling and analysis," in ICCAD, 2004, pp. 319-326.
    • (2004) ICCAD , pp. 319-326
    • Li, P.1    Pileggi, L.T.2    Asheghi, M.3    Chandra, R.4
  • 9
    • 0033904917 scopus 로고    scopus 로고
    • Interconnect thermal modeling for accurate simulation of circuit timing and reliability
    • February
    • D. Chen, E. Li, E. Rosenbaum, and S.-M. Kang, "Interconnect thermal modeling for accurate simulation of circuit timing and reliability," TCAD, pp. 197-205, February 2000.
    • (2000) TCAD , pp. 197-205
    • Chen, D.1    Li, E.2    Rosenbaum, E.3    Kang, S.-M.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.