-
1
-
-
0035440478
-
Thermal conductivity of doped polysilicon layers
-
September
-
A. D. McConnell, S. Uma, and K. E. Goodson, "Thermal conductivity of doped polysilicon layers," Journal of Microelectromechanical Systems, vol. 10, no. 3, pp. 360-369, September 2001.
-
(2001)
Journal of Microelectromechanical Systems
, vol.10
, Issue.3
, pp. 360-369
-
-
McConnell, A.D.1
Uma, S.2
Goodson, K.E.3
-
2
-
-
0003352129
-
Thermal performance challenges from silicon to systems
-
Aug
-
R. Viswanath, V. Wakharkar, A. Watwe, and V. Lebonheur, "Thermal performance challenges from silicon to systems," Intel Technology Journal, no. Q3, Aug. 2000.
-
(2000)
Intel Technology Journal
, Issue.Q3
-
-
Viswanath, R.1
Wakharkar, V.2
Watwe, A.3
Lebonheur, V.4
-
3
-
-
1542269367
-
Full chip leakage estimation considering power supply and temperature variations
-
H. Su, F. Liu, A. Devgan, E. Acar, and S. Nassif, "Full chip leakage estimation considering power supply and temperature variations," in ISLPED, 2003, pp. 78-83.
-
(2003)
ISLPED
, pp. 78-83
-
-
Su, H.1
Liu, F.2
Devgan, A.3
Acar, E.4
Nassif, S.5
-
4
-
-
0027850837
-
Electrothermal simulation of integrated circuits
-
S.-S. Lee and D. J. Allstot, "Electrothermal simulation of integrated circuits," JSSC, pp. 1283-1293, 1993.
-
(1993)
JSSC
, pp. 1283-1293
-
-
Lee, S.-S.1
Allstot, D.J.2
-
5
-
-
0032139246
-
ILLIADS-T: An electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips
-
Y.-K. Cheng, P. Raha, C.-C. Teng, E. Rosenbaum, and S.-M. Kang, "ILLIADS-T: An electrothermal timing simulator for temperature-sensitive reliability diagnosis of CMOS VLSI chips," TCAD, pp. 668-681, 1998.
-
(1998)
TCAD
, pp. 668-681
-
-
Cheng, Y.-K.1
Raha, P.2
Teng, C.-C.3
Rosenbaum, E.4
Kang, S.-M.5
-
6
-
-
0033712218
-
Fast temperature calculation for transient electrothermal simulation by mixed frequency/ time domain thermal model reduction
-
C.-H. Tsai and S.-M. Kang, "Fast temperature calculation for transient electrothermal simulation by mixed frequency/ time domain thermal model reduction," in DAC, 2000, pp. 750-755.
-
(2000)
DAC
, pp. 750-755
-
-
Tsai, C.-H.1
Kang, S.-M.2
-
7
-
-
0141527489
-
Thermal ADI: A lineartime chip level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method
-
T.-Y. Wang and C. C.-P. Chen, "Thermal ADI: A lineartime chip level dynamic thermal-simulation algorithm based on alternating-direction-implicit (ADI) method," TVLSI, pp. 691-700, 2003.
-
(2003)
TVLSI
, pp. 691-700
-
-
Wang, T.-Y.1
Chen, C.C.-P.2
-
8
-
-
16244394515
-
Efficient full-chip thermal modeling and analysis
-
P. Li, L. T. Pileggi, M. Asheghi, and R. Chandra, "Efficient full-chip thermal modeling and analysis," in ICCAD, 2004, pp. 319-326.
-
(2004)
ICCAD
, pp. 319-326
-
-
Li, P.1
Pileggi, L.T.2
Asheghi, M.3
Chandra, R.4
-
9
-
-
0033904917
-
Interconnect thermal modeling for accurate simulation of circuit timing and reliability
-
February
-
D. Chen, E. Li, E. Rosenbaum, and S.-M. Kang, "Interconnect thermal modeling for accurate simulation of circuit timing and reliability," TCAD, pp. 197-205, February 2000.
-
(2000)
TCAD
, pp. 197-205
-
-
Chen, D.1
Li, E.2
Rosenbaum, E.3
Kang, S.-M.4
|