Disassembly planning and sequencing for end-of-life products with RFID enriched information

Robotics and Computer-Integrated Manufacturing

Volumn 29, Issue 3, 2013, Pages 112-118

  Wan, Hung Da ^a   Gonnuru, Venkata Krishna ^a  

^a University of Texas at San Antonio   (United States)

Author keywords

Disassembly; End of life products; Fuzzy logic; Product lifecycle; Radio frequency identification (RFID)

Indexed keywords

BAYESIAN NETWORKS; COMPUTER CIRCUITS; ENVIRONMENTAL IMPACT; FUZZY LOGIC; GENETIC ALGORITHMS; PROFITABILITY; RADIO FREQUENCY IDENTIFICATION (RFID); RADIO WAVES; RECOVERY; RECYCLING;

DISASSEMBLY; DISASSEMBLY PLANNING; DISASSEMBLY PLANS; DISASSEMBLY SEQUENCE; END-OF-LIFE PRODUCTS; PRODUCT-LIFE-CYCLE; RADIO FREQUENCY IDENTIFICATION TECHNOLOGY; VISUAL INSPECTION;

LIFE CYCLE;

EID: 84885655160     PISSN: 07365845     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.rcim.2012.05.001     Document Type: Article

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