Phonon transmission and thermal conductance across graphene/Cu interface

Applied Physics Letters

Volumn 103, Issue 12, 2013, Pages

  Chen, Liang ^a   Huang, Zhen ^b   Kumar, Satish ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DENSITY OF STATE; LONGITUDINAL OPTICAL MODES; OUT-OF-PLANE; PHONON DISPERSIONS; PHONON TRANSMISSIONS; THERMAL BOUNDARY CONDUCTANCE; THERMAL CONDUCTANCE; TRANSVERSE OPTICAL;

PHYSICAL PROPERTIES; PHYSICS;

THERMAL CONDUCTIVITY;

EID: 84884895348     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4821439     Document Type: Article

References (37)

1. A. D. Liao, J. Z. Wu, X. R. Wang, K. Tahy, D. Jena, H. J. Dai, and E. Pop, Phys. Rev. Lett. 106, 256801 (2011). 10.1103/PhysRevLett.106.256801
2. F. Schwierz, Nature Nanotechnol. 5, 487 (2010). 10.1038/nnano.2010.89
3. T. H. Yu, C. W. Liang, C. Kim, E. S. Song, and B. Yu, IEEE Electron Device Lett. 32, 1110 (2011). 10.1109/LED.2011.2158385
4. Y. K. Koh, M. H. Bae, D. G. Cahill, and E. Pop, Nano Lett. 10, 4363 (2010). 10.1021/nl101790k
5. P. M. Norris, J. L. Smoyer, J. C. Duda, and P. E. Hopkins, ASME Trans. J. Heat Transfer 134, 020910 (2012). 10.1115/1.4004932
6. A. J. Schmidt, K. C. Collins, A. J. Minnich, and G. Chen, J. Appl. Phys. 107, 104907 (2010). 10.1063/1.3428464
7. J. J. Gengler, S. V. Shenogin, J. E. Bultman, A. K. Roy, A. A. Voevodin, and C. Muratore, J. Appl. Phys 112, 094904 (2012). 10.1063/1.4764006
8. A. K. Vallabhaneni, B. Qiu, J. N. Hu, Y. P. Chen, A. K. Roy, and X. L. Ruan, J. Appl. Phys 113, 064311 (2013). 10.1063/1.4790367
9. Z. Chen, W. Jang, W. Bao, C. N. Lau, and C. Dames, Appl. Phys. Lett. 95, 161910 (2009). 10.1063/1.3245315
10. L. Adamska, Y. Lin, A. J. Ross, M. Batzill, and I. I. Oleynik, Phys. Rev. B 85, 195443 (2012). 10.1103/PhysRevB.85.195443
11. G. Giovannetti, P. A. Khomyakov, G. Brocks, V. M. Karpan, J. van den Brink, and P. J. Kelly, Phys. Rev. Lett. 101, 026803 (2008). 10.1103/PhysRevLett.101.026803
12. C. Gong, G. Lee, B. Shan, E. M. Vogel, R. M. Wallace, and K. Cho, J. Appl. Phys. 108, 123711 (2010). 10.1063/1.3524232
13. Y. Matsuda, W. Q. Deng, and W. A. Goddard, J. Phys. Chem. C 111, 11113 (2007). 10.1021/jp072794a
14. Z. P. Xu and M. J. Buehler, J. Phys. Condens. Matter 22, 485301 (2010). 10.1088/0953-8984/22/48/485301
15. M. Vanin, J. J. Mortensen, A. K. Kelkkanen, J. M. Garcia-Lastra, K. S. Thygesen, and K. W. Jacobsen, Phys. Rev. B 81, 081408 (2010). 10.1103/PhysRevB.81.081408
16. N. Mingo and L. Yang, Phys. Rev. B 68, 245406 (2003). 10.1103/PhysRevB.68.245406
17. W. Zhang, T. S. Fisher, and N. Mingo, Numer. Heat Transfer, Part B 51, 333 (2007). 10.1080/10407790601144755
18. A. Bulusu and D. G. Walker, J. Appl. Phys. 102, 073713 (2007). 10.1063/1.2787162
19. J. P. Perdew and A. Zunger, Phys. Rev. B 23, 5048 (1981). 10.1103/PhysRevB.23.5048
20. See supplementary material at http://dx.doi.org/10.1063/1.4821439 E-APPLAB-103-036338 for parameters used in DFT and AGF calculations.
21. A. M. Shikin, D. Farias, and K. H. Rieder, Europhys. Lett. 44, 44 (1998). 10.1209/epl/i1998-00432-x
22. T. Aizawa, R. Souda, S. Otani, Y. Ishizawa, and C. Oshima, Phys. Rev. B 42, 11469 (1990). 10.1103/PhysRevB.42.11469
23. A. Allard and L. Wirtz, Nano Lett. 10, 4335 (2010). 10.1021/nl101657v
24. S. Siebentritt, R. Pues, K. H. Rieder, and A. M. Shikin, Phys. Rev. B 55, 7927 (1997). 10.1103/PhysRevB.55.7927
25. H. Yanagisawa, T. Tanaka, Y. Ishida, M. Matsue, E. Rokuta, S. Otani, and C. Oshima, Surf. Interface Anal. 37, 133 (2005). 10.1002/sia.1948
26. L. Wirtz and A. Rubio, Solid State Commun. 131, 141 (2004). 10.1016/j.ssc.2004.04.042
27. A. M. Shikin, V. K. Adamchuk, and K. H. Rieder, Phys. Solid State 51, 2390 (2009). 10.1134/S1063783409110316
28. F. Ducastel and F. Cyrotlac, J. Phys. Chem. Solids 31, 1295 (1970). 10.1016/0022-3697(70)90134-4
29. F. Guinea, C. Tejedor, F. Flores, and E. Louis, Phys. Rev. B 28, 4397 (1983). 10.1103/PhysRevB.28.4397
30. J. Li, T. C. A. Yeung, and C. H. Kam, J. Appl. Phys. 111, 094308 (2012). 10.1063/1.4709755
31. L. Lindsay and D. A. Broido, Phys. Rev. B 81, 205441 (2010). 10.1103/PhysRevB.81.205441
32. Z. Huang, T. S. Fisher, and J. Y. Murthy, J. Appl. Phys. 108, 094319 (2010). 10.1063/1.3499347
33. K. Saito, J. Nakamura, and A. Natori, Phys. Rev. B 76, 115409 (2007). 10.1103/PhysRevB.76.115409
34. J. H. Seol, I. Jo, A. L. Moore, L. Lindsay, Z. H. Aitken, M. T. Pettes, X. S. Li, Z. Yao, R. Huang, D. Broido, N. Mingo, R. S. Ruoff, and L. Shi, Science 328, 213 (2010). 10.1126/science.1184014
35. P. E. Hopkins, J. C. Duda, and P. M. Norris, ASME Trans. J. Heat Transfer 133, 062401 (2011). 10.1115/1.4003549
36. H. K. Lyeo and D. G. Cahill, Phys. Rev. B 73, 144301 (2006). 10.1103/PhysRevB.73.144301
37. R. J. Stevens, L. V. Zhigilei, and P. M. Norris, Int. J. Heat Mass Transfer 50, 3977 (2007). 10.1016/j.ijheatmasstransfer.2007.01.040