Thermal stability of high-power leds analyzed with efficient nondestructive methodology

IEEE Transactions on Device and Materials Reliability

Volumn 13, Issue 3, 2013, Pages 401-406

  Lee, Pei Hsuan ^a   Chou, Jung Hua ^a   Tseng, Hsien Cheng ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b KUN SHAN UNIVERSITY   (Taiwan)

Author keywords

High power light emitting diode (LED); Junction temperature; Lifetime; Luminous flux; Thermal resistance

Indexed keywords

3-D NUMERICAL SIMULATION; HIGH-POWER LIGHT-EMITTING DIODES; JUNCTION TEMPERATURES; LIFETIME; LIGHT-EMITTING EFFICIENCY; LUMINOUS CHARACTERISTIC; LUMINOUS FLUX; NON DESTRUCTIVE EVALUATION;

EXPERIMENTS; HEAT RESISTANCE; MULTICHIP MODULES; NONDESTRUCTIVE EXAMINATION;

LIGHT EMITTING DIODES;

EID: 84883750322     PISSN: 15304388     EISSN: 15582574     Source Type: Journal    
DOI: 10.1109/TDMR.2013.2256909     Document Type: Article

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