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Volumn , Issue , 2012, Pages 2796-2799

A 232-channel retinal vision prosthesis with a miniaturized hermetic package

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA CERAMIC; ELECTRODE ARRAYS; ELECTRONIC CIRCUITRY; HELIUM LEAK TESTING; HERMETIC PACKAGES; HIGH TEMPERATURE; IMPLANTABLE DEVICES; INDIVIDUAL TECHNOLOGY; INDUCTIVE COUPLINGS; INTERLAYER ADHESION; LIFETIME ESTIMATION; LIMITED SPACE; METAL LAYER; POLYMER CARRIER; RADIO FREQUENCY COILS; SIC COATINGS; SOLDER GLASS; VISION PROSTHESIS;

EID: 84882973579     PISSN: 1557170X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMBC.2012.6346545     Document Type: Conference Paper
Times cited : (26)

References (15)
  • 4
  • 5
    • 84870813021 scopus 로고    scopus 로고
    • A neural stimulator frontend with high-voltage compliance and programmable pulse shape for epiretinal implants
    • Noorsal, E.; Sooksood, K.; Hongcheng Xu; Hornig, R.; Becker, J.; Ortmanns, M. "A Neural Stimulator Frontend With High-Voltage Compliance and Programmable Pulse Shape for Epiretinal Implants" IEEE J. of Solid-State Circuits, 47 (1), pp. 244-256, 2012
    • (2012) IEEE J. of Solid-State Circuits , vol.47 , Issue.1 , pp. 244-256
    • Noorsal, E.1    Sooksood, K.2    Xu, H.3    Hornig, R.4    Becker, J.5    Ortmanns, M.6
  • 11
    • 0023434288 scopus 로고
    • Twenty years of neurological prosthesis-making
    • Donaldson P.E.K. "Twenty years of neurological prosthesis- making" J. Biomed. Eng., vol 9 pp. 291-298 1987
    • (1987) J. Biomed. Eng. , vol.9 , pp. 291-298
    • Donaldson, P.E.K.1
  • 12
    • 78650838681 scopus 로고    scopus 로고
    • A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packages
    • Schuettler M, Huegle M, Ordonez J.S, Wilde J, Stieglitz T, "A Device for Vacuum Drying, Inert Gas Backfilling and Solder Sealing of Hermetic Implant Packages" Proc IEEE EMBC pp. 1577-1580 2010
    • (2010) Proc IEEE EMBC , pp. 1577-1580
    • Schuettler, M.1    Huegle, M.2    Ordonez, J.S.3    Wilde, J.4    Stieglitz, T.5
  • 14
    • 0031653883 scopus 로고    scopus 로고
    • Microflex: A new technique for hybrid integration for microsystems
    • Beutel H, Stieglitz T, Meyer, J, "Microflex: a new technique for hybrid integration for microsystems," Proc. MEMS pp. 306-311, 1998
    • (1998) Proc. MEMS , pp. 306-311
    • Beutel, H.1    Stieglitz, T.2    Meyer, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.