A device for vacuum drying, inert gas backfilling and solder sealing of hermetic implant packages

2010 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC'10

Volumn , Issue , 2010, Pages 1577-1580

  Schuettler, Martin ^a   Huegle, Matthias ^a   Ordonez, Juan S ^a   Wilde, Juergen ^b   Stieglitz, Thomas ^a  

^a UNIVERSITY OF FREIBURG   (Germany)

^b IMTEK   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC CIRCUITS; IMPLANTED DEVICE; MOISTURE PROTECTION; OPERATION PROCEDURE; RESIDUAL MOISTURE; VACUUM DRYING;

MICROELECTRONICS; MOISTURE; PACKAGING;

INERT GASES;

HELIUM; WATER;

ARTICLE; CHEMISTRY; DESICCATION; EQUIPMENT; EQUIPMENT DESIGN; EQUIPMENT FAILURE; METHODOLOGY; PACKAGING; PROSTHESES AND ORTHOSES; VACUUM; WELDING;

DESICCATION; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HELIUM; PRODUCT PACKAGING; PROSTHESES AND IMPLANTS; VACUUM; WATER; WELDING;

EID: 78650838681     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMBS.2010.5626688     Document Type: Conference Paper

References (4)

1. R.W. Thomas: "Moisture, Myths, and Microcircuits", IEEE Transactions on Parts, Hybrids, and Packaging, Vol. PHP-12, No. 3, pp. 167-171, 1976.
2. M. Schuettler, J.S. Ordonez, T. Silva Santisteban, A. Schatz, J. Wilde, T. Stieglitz: "Fabrication and Test of a Hermetic Miniature Implant Package with 360 Electrical Feedthroughs", Submitted to the IEEE EMBC 2010.
3. G. Humpston and D.M. Jacobson: "Dryness and Hermeticity of Sealed Enclosures" in Principles of Soldering, ASM International, pp. 184-187, 2004.
4. H. Greenhouse: "Understanding Helium Fine Leak Testing in Accordance with Method 1014, MIL-STD-883" in Hermeticity of Electronic Packages, Ed. H. Greenhouse, Noyes Publications, pp, 196-244, 2000.